Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration

Cheng, Shu-Feng; Huang, Po-Tsang; Wang, Li-Chun; Chang, Mau-Chung Frank

doi:10.1109/MDAT.2019.2932935

Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration

Date

2019-12-01

Authors

Cheng, Shu-Feng

Huang, Po-Tsang

Wang, Li-Chun

Chang, Mau-Chung Frank

DOI

10.1109/MDAT.2019.2932935

Abstract

Editor's note: Multiband radio-frequency interconnect (MRFI) is an emerging technology to achieve low-latency and energy-efficient on-chip communication. This article proposes a BIST method to improve the reliability of MRFI-based design. -Partha Pratim Pande, Washington State University

Keywords

Through-silicon vias, Built-in self-test, Maintenance engineering, Three-dimensional displays, Circuit faults, Bandwidth, Frequency division multiplexing, multiband RF-Interconnect, test methodology, TSV density, yield improvement, PRBS, phase error, BIST, R, e-fuse

URI

http://dx.doi.org/10.1109/MDAT.2019.2932935
https://ir.lib.nycu.edu.tw/handle/11536/153438

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Built-In Self-Test/Repair Methodology for Multiband RF-Interconnected TSV 3D Integration

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