銅與低介電材料介電層之系統整合及可靠度提升研究(I)
| dc.contributor.author | 邱碧秀 | en_US |
| dc.contributor.author | CHIOU BI-SHIOU | en_US |
| dc.contributor.department | 交通大學電子工程系 | zh_TW |
| dc.date.accessioned | 2014-12-13T10:34:31Z | |
| dc.date.available | 2014-12-13T10:34:31Z | |
| dc.date.issued | 2002 | en_US |
| dc.description.sponsorship | 行政院國家科學委員會 | zh_TW |
| dc.identifier.govdoc | NSC91-2216-E009-023 | zh_TW |
| dc.identifier.uri | https://www.grb.gov.tw/search/planDetail?id=785501&docId=151054 | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/92794 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | 銅與低介電材料介電層之系統整合及可靠度提升研究(I) | zh_TW |
| dc.title | The Reliability Enhancement for the Integrated System of Copper and Low K Dielectric Interconnect (I) | en_US |
| dc.type | Plan | en_US |