高階助聽器晶片及系統-子計畫二:助聽器雙耳通訊技術( II )

dc.contributor.author桑梓賢en_US
dc.contributor.authorSang Tzu-Hsienen_US
dc.contributor.department國立交通大學電子工程學系及電子研究所zh_TW
dc.date.accessioned2014-12-13T10:42:39Z
dc.date.available2014-12-13T10:42:39Z
dc.date.issued2011en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC100-2220-E009-003zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=2363762&docId=374333en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/99299
dc.language.isozh_TWen_US
dc.subject雙耳助聽器zh_TW
dc.subject雙耳通訊系統zh_TW
dc.subject皮膚通道zh_TW
dc.subject通訊協定zh_TW
dc.subject聲音訊源編碼zh_TW
dc.subject傳接器電路設計zh_TW
dc.subjectbinaural hearing aidsen_US
dc.subjectbinaural communication systemen_US
dc.subjectskin channelen_US
dc.subjectcommunication protocolen_US
dc.subjectacoustic source codingen_US
dc.subjecttransceiver circuit designen_US
dc.title高階助聽器晶片及系統-子計畫二:助聽器雙耳通訊技術( II )zh_TW
dc.titleCommunication Technology for Binaural Hearing Aidsen_US
dc.typePlanen_US

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