Performance Improvements of AlGaN/GaN HEMTs by Strain Modification and Unintentional Carbon Incorporation

Abstract

An advanced AlGaN/GaN HEMT structure, grown on a sapphire substrate by MOCVD utilizing a high temperature (HT) AN interlayer (IL) and a multilayer high-low-high temperature (HLH) AN buffer layer, demonstrates a superior performance both in breakdown voltage (>200 V) and maximum drain current (Ipss = 667 mA/mm). The HT AN IL produces an additional compressive strain into the above GaN layer. Accordingly, an AlGaN barrier, grown on the more compressive GaN, introduces less tensile strain leading to an improvement in surface morphology (RMS = 0.19 nm in 2 x 2 mu m(2)), a remarkable increase in 2DEG mobility by 46% (mu(S)= 1900 cm(2)/Vs) and a decrease in densities of defects acting as paths for the leakage current through the AlGaN barrier. A high semi-insulating buffer is achieved by eliminating leakage paths both through the buffer layer and the buffer-substrate interfacial layer. These result from an increase in unintentional carbon introduced by AIN layers, especially by a low temperature AN layer; which are grown under low pressure (50 Ton). Lastly, the decrease in AlGaN barrier tensile strain and low leakage current in the advanced HEMTs structure using an HT AN IL and an HLH AIN buffer are promising for an improvement in AlGaN/GaN HEMTs\' reliability.