具實用性及交期導向之IC封裝廠排程演算法則之設計與應用

Thumbnail Image

Files

902218E009019.pdf (316.23 KB)
 902218E009019.pdf (316.23 KB)

Date

2001

Authors

Journal Title

Journal ISSN

Volume Title

Publisher

DOI

Abstract

Description

Keywords

IC封裝, 排程, 演算法, 交期指定, 實用性, IC packaging, Scheduling, Algorithm, Due date assignment, Practicability

Citation

URI

https://www.grb.gov.tw/search/planDetail?id=674285&docId=128524
 https://ir.lib.nycu.edu.tw/handle/11536/93590

Collections

研究計畫;;Research Plans

Endorsement

Review

Supplemented By

Referenced By