The effect of substrate surface roughness on the wettability of Sn-Bi solders

Abstract

The effect of substrate surface roughness on the wettability of Sn-Bi solders is investigated by the eutectic Sn-Bi alloy on Cu/Al2O3 substrates at 190 degrees C. To engineer the surface with different roughnesses, the Cu-side of the substrates is polished with sandpaper with abrasive number 100, 240, 400, 600, 800, 1200, and 1 mu m alumina powder, respectively. Both dynamic and static contact angles of the solder drops are studied by the real-time image in a dynamic contact angle analyzer system (FTA200). During dynamic wetting, the wetting velocity of the solder drop decreases for the rougher surface. However, the time to reach the static contact angle seems to be identical with different substrate surface roughness. The wetting tip of the solder cap exhibits a waveform on the rough surface, indicating that the liquid drop tends to flow along the valley. As the solder drops reach a static state, the static contact angle increases with the substrate surface roughness. This demonstrates that the wettability of solders degrades as the substrates become rough.