Browsing by Author "Chen, Yen-Chi"

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A Novel Si-based X'tal Oscillator Device Using 3D Integration Technologies
(2014-01-01)
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiu, Chih-Hung
;
Lo, Chung-Lun
;
Chen, Kuan-Neng
A novel Si-based X\'tal oscillator device (1.2 mm x 1.0 mm) is demonstrated by using 3D integration technologies. It is distinct from conventional X\'tal oscillator device with ceramics and metal lid. The novel Si-based X\'tal oscillator device shows no leakage path, and passes the hermetic encapsulation test and reliability investigation. In addition, the novel device shows the excellent electrical characteristics and provides the possibility to replace the conventional fabrication approach for the next generation products.
Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding Structure
(2014)
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Lee, Shih-Wei
;
Hu, Yu-Chen
;
Chiu, Chih-Hung
In this paper, a novel crystal component package based on silicon TSV interposer substrate is demonstrated by using 3D integration technologies. It is distinct from conventional crystal component using ceramic-based substrate. This crystal component with advanced silicon-based substrate shows great manufacturability to replace traditional fabrication approach. In addition, the SU-8 sealing bonding structure provides the possibility to substitute for the conventional metal lid with reliability investigation. Finally, a novel silicon-based crystal component package with 3D integration is successfully fabricated through general semiconductor techniques to replace traditional manufacture.
Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic Sealing
(2013-08-01)
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiu, Chih-Hung
;
Hu, Yu-Chen
;
Lo, Chung-Lun
An advanced crystal resonator device scheme using Cu through-silicon via (TSV), 3-D integration, and Si packaging technologies is successfully demonstrated. In addition to robust structural quality, the crystal resonator packaging has excellent electrical characteristics of low leakage current and reliability against harsh environment for MIL-STD-883 hermetic encapsulation. Using 3-D integration technologies and Si packaging, the proposed TSV-based crystal resonator device possesses the manufacturability potential while conventional ones using a metal lid or ceramic enclosure.
Device Characteristics of TSV-Based Piezoelectric Resonator With Load Capacitance and Static Capacitance Modification
(2015-03-01)
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiu, Chih-Hung
;
Lo, Chung-Lun
;
Chang, Chi-Chung
The piezoelectric resonator device based on 3-D integration technologies and hermetic sealing bonding is presented with conventional semiconductor process. To pursue small form factor, high-performance, and cost-effective technologies, this through-silicon via (TSV)-based resonator is fabricated by CuSn eutectic bonding for hermeticity, wafer-level thinning, and Cu TSVs interconnection, while high-temperature cofired ceramic (HTCC) with metal lid is applied in the conventional resonator devices. The device characteristics and reliability of TSV-based resonator reveal it has great performance and outstanding quality. In addition, the device characteristics with load capacitance and its improvement through modification of the isolation in TSV-based substrate are discussed in this research. Demonstrations of these characteristics show that the TSV-based resonator possesses advantages and compatibility with current semiconductor process, as well as the manufacturability compared with the conventional metal lid with HTCC enclosures.
Enhancing the performance of photovoltaic cells by using down-converting KCaGd(PO(4))(2):Eu(3+) phosphors
(2011-09-01)
Chen, Yen-Chi
;
Huang, Woan-Yu
;
Chen, Teng-Ming
;
應用化學系
;
Department of Applied Chemistry
The goal of this work is aimed to improve the power conversion efficiency of single crystalline silicon-based photovoltaic (PV) cells by using the solar spectral conversion principle, which employed a down-converting phosphor to convert a high-energy ultraviolet photon to the less energetic red-emitting photons to improve the spectral response of Si solar cells. In this study, the surface of silicon solar cells was coated with a red-emitting KCaGd(PO(4))(2):Eu(3+) phosphor by using the screen-printing technique. In addition to the investigation on the microstructure using scanning electron microscopy (SEM), we measured the short circuit current (I(sc)), open circuit voltage (V(oc)), and power conversion efficiency (eta) of spectral-conversion cells and compared with those of bare solar cells as a reference. Preliminary experimental results revealed that in an optimized PV cell, an enhancement of (0.64+0.01)% (from 16.03% to 16.67%) in Delta eta of a Si-based PV cell was achieved.
Enhancing the performance of photovoltaic cells by using down-converting KCaGd(PO4)(2):Eu3+ phosphors
(2011-09-01)
Chen, Yen-Chi
;
Huang, Woan-Yu
;
Chen, Teng-Ming
;
應用化學系
;
Department of Applied Chemistry
The goal of this work is aimed to improve the power conversion efficiency of single crystalline silicon-based photovoltaic (PV) cells by using the solar spectral conversion principle, which employed a down-converting phosphor to convert a high-energy ultraviolet photon to the less energetic red-emitting photons to improve the spectral response of Si solar cells. In this study, the surface of silicon solar cells was coated with a red-emitting KCaGd(PO4)(2):Eu3+ phosphor by using the screen-printing technique. In addition to the investigation on the microstructure using scanning electron microscopy (SEM), we measured the short circuit current (I-sc), open circuit voltage (V-oc), and power conversion efficiency (eta) of spectral-conversion cells and compared with those of bare solar cells as a reference. Preliminary experimental results revealed that in an optimized PV cell, an enhancement of (0.64+0.01)% (from 16.03% to 16.67%) in Delta eta of a Si-based PV cell was achieved.
Hydrogel-based zinc ion sensor on optical fiber with high resolution and application to neural cells
(2020-08-15)
Tsai, May-Jywan
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Cheng, Henrich
;
Ho, Hsin-Hsien
;
Lin, Peng-Wei
;
Liou, Dann-Ying
Solid-state zinc ion sensor is developed with high enough resolution and reproducibility for the potential application in brain injury monitoring. An optical diffuser is incorporated into the zinc ion sensor based on optical fiber and hydrogel doped with the fluorescent zinc ion probe molecule meso-2,6-Dichlomphenyltripyrrinone (TPN-Cl-2). The diffuser transforms the high-peak-intensity excitation light near the fiber end into a broad light with moderate local intensity to reduce the degradation of the probe molecule. Reversible detection can be reached for 1, 2, and 5 mu m (10(-6) Molar), with slopes 0.3, 0.6, and 0.8 respectively. This is the pathophysiological concentration range after brain injury. The sensor is applied to neuron-glial cultures and macrophage under the stimulation of lipopolysaccharide (LPS), KCl and oxygen/glucose deprivation (OGD) that reflect inflammation, depolarization and ischemia respectively, mimicking events after brain injury. The zinc ion level is raised to 4-5 mu m after LPS treatment, and then reduced to <3 mu m after the co-treatment with the herbal drug silymarin. The results suggest the conditions of the neural cells under stress can be monitored.
Improvement of conversion efficiency of silicon solar cells using up-conversion molybdate La(2)Mo(2)O(9):Yb,R (R=Er, Ho) phosphors
(2011-08-01)
Chen, Yen-Chi
;
Chen, Teng-Ming
;
應用化學系
;
Department of Applied Chemistry
The goal of this work was aimed to improve the power conversion efficiency of single crystalline silicon-based photovoltaic cells by using the solar spectral conversion principle, which employs an up-conversion phosphor to convert a low energy infrared photon to the more energetic visible photons to improve the spectral response. In this study, the surface of multicrystalline silicon solar cells was coated with an up-conversion molybdate phosphor to improve the spectral response of the solar cell in the near-infrared spectral range. The short circuit current (I(sc)), open circuit voltage (V(oc)), and conversion efficiency (eta) of spectral conversion cells were measured. Preliminary experimental results revealed that the light conversion efficiency of a 1.5%-2.7% increase in Si-based cell was achieved.
Improvement of conversion efficiency of silicon solar cells using up-conversion molybdate La2Mo2O9:Yb,R (R=Er, Ho) phosphors
(2011-08-01)
Chen, Yen-Chi
;
Chen, Teng-Ming
;
應用化學系
;
Department of Applied Chemistry
The goal of this work was aimed to improve the power conversion efficiency of single crystalline silicon-based photovoltaic cells by using the solar spectral conversion principle, which employs an up-conversion phosphor to convert a low energy infrared photon to the more energetic visible photons to improve the spectral response. In this study, the surface of multicrystalline silicon solar cells was coated with an up-conversion molybdate phosphor to improve the spectral response of the solar cell in the near-infrared spectral range. The short circuit current (I-sc), open circuit voltage (V-oc), and conversion efficiency (eta) of spectral conversion cells were measured. Preliminary experimental results revealed that the light conversion efficiency of a 1.5%-2.7% increase in Si-based cell was achieved.
Motional Resistance Issue of TSV-Based Resonator Device and Its Improvement With a Concave Cu TSV Structural Design
(2014-08-01)
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiu, Chih-Hung
;
Chen, Kuan-Neng
;
交大名義發表
Motional resistance of TSV-based resonator devices with 3D integration techniques is investigated at the operating oscillating mode. Even with well-developed TSV and device fabrication, the motional resistance issue of the TSV-based resonator device is found due to the poor connected Ag paste. The corresponding solution is demonstrated by a modified concave Cu TSVs structure. This modified concave Cu TSV design shows the excellent device characteristics and no visible gaps between the Cu TSVs and resonator devices to insure a good electrical connection.
Near UV-pumped yellow-emitting Sr(8)MgSc(PO(4))(7):Eu(2+) phosphor for white-light LEDs with excellent color rendering index
(2011-01-01)
Huang, Chien-Hao
;
Chen, Yen-Chi
;
Chen, Teng-Ming
;
Chan, Ting-Shan
;
Sheu, Hwo-Shuenn
An Eu(2+)-activated Sr(8)MgSc(PO(4))(7):Eu(2+) yellow-emitting phosphor with strong luminescence was synthesized and its crystal structure has been refined and determined from the XRD profiles using synchrotron light source by Rietveld refinement method. Non-radiative transitions between Eu(2+) ions in the Sr(8)MgSc(PO(4))(7) host have also been demonstrated to be attributable to dipole-dipole interactions, and the critical distance was estimated to be 24.83 angstrom by using spectral overlap methods. In addition, white-light near-UV LEDs were fabricated by using a phosphor blend of composition-optimized yellow-emitting Sr(8)MgSc(PO(4))(7):0.01Eu(2+) and blue-emitting BaMgAl(10)O(17):Eu(2+) commodity pumped with a 400 nm near-UV chip and the Ra value and reduced color temperature of were found to be 96.7 and 5,614 K, respectively. These results indicate that yellow-emitting Sr(8)MgSc(PO(4))(7):xEu(2+) can serve as a promising candidate for application in white-light LEDs.
Near UV-pumped yellow-emitting Sr8MgSc(PO4)(7):Eu2+ phosphor for white-light LEDs with excellent color rendering index
(2011-01-01)
Huang, Chien-Hao
;
Chen, Yen-Chi
;
Chen, Teng-Ming
;
Chan, Ting-Shan
;
Sheu, Hwo-Shuenn
An Eu2+-activated Sr8MgSc(PO4)(7):Eu2+ yellow-emitting phosphor with strong luminescence was synthesized and its crystal structure has been refined and determined from the XRD profiles using synchrotron light source by Rietveld refinement method. Non-radiative transitions between Eu2+ ions in the Sr8MgSc(PO4)(7) host have also been demonstrated to be attributable to dipole-dipole interactions, and the critical distance was estimated to be 24.83 angstrom by using spectral overlap methods. In addition, white-light near-UV LEDs were fabricated by using a phosphor blend of composition-optimized yellow-emitting Sr8MgSc(PO4)(7):0.01Eu(2+) and blue-emitting BaMgAl10O17:Eu2+ commodity pumped with a 400 nm near-UV chip and the Ra value and reduced color temperature of were found to be 96.7 and 5,614 K, respectively. These results indicate that yellow-emitting Sr8MgSc(PO4)(7):xEu(2+) can serve as a promising candidate for application in white-light LEDs.
Novel green-emitting Na(2)CaPO(4)F:Eu(2+) phosphors for near-ultraviolet white light-emitting diodes
(2011-07-01)
Huang, Chien-Hao
;
Chen, Yen-Chi
;
Kuo, Te-Wen
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Chen, Teng-Ming
;
應用化學系
In this study, green-emitting Na(2)CaPO(4)F:Eu(2+) phosphors were synthesized by solid-state reactions. The excitation spectra of the phosphors showed a broad hump between 250 and 450 nm; the spectra match well with the near-ultraviolet (NUV) emission spectra of light-emitting diodes (LEDs). The emission spectrum showed an intense broad emission band centered at 506 nm. White LEDs were fabricated by integrating a 390 nm NUV chip comprising blue-emitting BaMgAl(10)O(17):Eu(2+), green-emitting Na(2)CaPO(4)F:0.02 Eu(2+), and red-emitting CaAlSiN(3):Eu(2+) phosphors into a single package; the white LEDs exhibited white light with a correlated color temperature of 5540 K. a color-rendering index of 90.75, and color coordinates (0.332, 0.365) close to those of ideal white light. (C) 2011 Elsevier B.V. All rights reserved.
Novel green-emitting Na2CaPO4F:Eu2+ phosphors for near-ultraviolet white light-emitting diodes
(2011-07-01)
Huang, Chien-Hao
;
Chen, Yen-Chi
;
Kuo, Te-Wen
;
Chen, Teng-Ming
;
應用化學系
In this study, green-emitting Na2CaPO4F:Eu2+ phosphors were synthesized by solid-state reactions. The excitation spectra of the phosphors showed a broad hump between 250 and 450 nm; the spectra match well with the near-ultraviolet (NUV) emission spectra of light-emitting diodes (LEDs). The emission spectrum showed an intense broad emission band centered at 506 nm. White LEDs were fabricated by integrating a 390 nm NUV chip comprising blue-emitting BaMgAl10O17:Eu2+, green-emitting Na2CaPO4F:0.02 Eu2+, and red-emitting CaAlSiN3:Eu2+ phosphors into a single package; the white LEDs exhibited white light with a correlated color temperature of 5540 K. a color-rendering index of 90.75, and color coordinates (0.332, 0.365) close to those of ideal white light. (C) 2011 Elsevier B.V. All rights reserved.
Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
(2014-10-01)
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiu, Chih-Hung
;
Lo, Chung-Lun
;
Chang, Chi-Chung
This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.
TSV-Based Quartz Crystal Resonator Using 3D Integration and Si Packaging Technologies
(2013)
Shih, Jian-Yu
;
Chen, Yen-Chi
;
Chiang, Cheng-Hao
;
Chiu, Chih-Hung
;
Hu, Yu-Chen
In this paper, one novel packaging approach for crystal resonator with the quartz crystal is demonstrated, developed and characterized. The proposed crystal resonator of the novel package adopts several 3-D core technologies, such as Cu TSVs, thin-film Cu/Sn eutectic bonding, and wafer thinning. A 1210 crystal resonator with quartz blank mount is successfully developed with Cu TSVs that enables the electrical connection of the signal electrode on the quartz blank. The quartz blank is protected by the simultaneous formation of strength reinforcement and excellent sealing capacity of thin-film Cu/Sn eutectic bonding. With the well fabrication and the enhanced structure, excellent leakage results in the MIL-STD-883 hermetic test (8.5*10(-9) similar to 1*10(-8) Pa m(3)/sec by He leak detector) show the crystal resonator using 3D integration has the great performance and manufacturability to replace the conventional metal or ceramic enclosures for the next generation products.