Advanced Crystal Component Package with Silicon TSV Interposer Using 3D Integration and Novel SU-8 Polymer Sealing Bonding Structure

Abstract

In this paper, a novel crystal component package based on silicon TSV interposer substrate is demonstrated by using 3D integration technologies. It is distinct from conventional crystal component using ceramic-based substrate. This crystal component with advanced silicon-based substrate shows great manufacturability to replace traditional fabrication approach. In addition, the SU-8 sealing bonding structure provides the possibility to substitute for the conventional metal lid with reliability investigation. Finally, a novel silicon-based crystal component package with 3D integration is successfully fabricated through general semiconductor techniques to replace traditional manufacture.