Browsing by Author "Chih-Wei"
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Item type:Item, Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same(2011-01-25) ;Chiou ;Jin-Chern ;ChangChih-WeiThe present invention discloses an integration structure of a semiconductor circuit and microprobe sensing elements and a method for fabricating the same. In the method of the present invention, a semiconductor circuit is fabricated on one surface of a semiconductor substrate, and the other surface of the semiconductor substrate is etched to form a microprobe structure for detect physiological signals. Next, a deposition method is used to sequentially form an electrical isolated layer and an electrical conductive layer on the microprobes. Then, an electrical conductive material is used to electrically connect the electrical conductive layer with the electrical pads of the semiconductor circuit. Thus is achieved the integration of a semiconductor circuit and microprobe sensing elements in an identical semiconductor substrate with the problem of electric electrical isolated being solved simultaneously. Thereby, the voltage level detected by the microprobes will not interfere with the operation of the semiconductor circuit.Item type:Item, Method and apparatus for self-compensation on belief-propagation algorithm(2009-12-08) ;Liao ;Yen-Chin ;Lin ;Chien-ChingChangA self-compensation method includes: firstly using a min-sum algorithm to derive multiple output values in order to approach a operational result of the checking side of a belief-propagation; and then checking the present iteration number of decoding based on a checking rule; and finally, if in the previous step the present iteration number is identified with a to-be-corrected state, then performing a compensation procedure on the multiple output values, wherein the compensation term is dynamically selected in accordance with an input value of the checking nodes of the belief-propagation. The invention also provides an automatic compensation apparatus, which consists of devices such as a min-sum operating unit, and a dynamic quantization control unit, etc., which can be used, while executing the invented method described above, to decode the belief-propagation algorithm.Item type:Item, Method for fabricating microneedle array and method for fabricating embossing mold of microneedle array(2008-09-30) ;Chiou ;Jin-Chern ;Hung ;Chen-ChunChangThe present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.