Browsing by Author "Feng, MS"

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A bilayer Ti/Ag ohmic contact for highly doped n-type GaN films
(1996-01-08)
Guo, JD
;
Lin, CI
;
Feng, MS
;
Pan, FM
;
Chi, GC
Ohmic contacts with low resistance are fabricated on n-type GaN films using Ti/Ag bilayer metallization. The GaN films are grown by low pressure metalorganic chemical vapor deposition (LP-MOCVD) with Si as the dopant. Ohmic characteristics are studied for films with carrier concentration range from 1.5 x 10(17) to 1.7 x 10(19) cm(-3). The lowest value for the specific contact resistivity of 6.5 x 10(-5) Ohm cm(2) is obtained without annealing. The barrier height of Ti on GaN is calculated to be 0.067 eV. (C) 1996 American Institute of Physics.
A modified multi-chemicals spray cleaning process for post-CMP cleaning application
(1998-01-01)
Wang, YL
;
Liu, C
;
Feng, MS
;
Tseng, WT
;
材料科學與工程學系
Chemical mechanical planarization (CMP) has become widely accepted for the planarization of device interconnect structures in deep submicron semiconductor manufacturing. Attractive features of CMP include (i) global planarization and (ii) low defect and contamination level. The main challenge of cleaning is to remove the residual particles as well as the metallic contamination. In this paper, a modified post-CMP clean up-multi-chemicals spray cleaning process-is addressed in detail. This new process has been successfully applied to both oxide and tungsten CMP cleaning. The process provides comparable defect performance and excellent removal of metallic contamination to the scrubbing process which has been widely accepted in current post-CMP cleaning usage. The new clean up development strategy also contributes to their low cost of ownership (Co0) and good process flexibility as well as the minimizing cross-contamination. (C) 1998 Elsevier Science S.A.
A modified multi-chemicals spray cleaning process for post-CMP cleaning application
(1998-01-01)
Wang, YL
;
Liu, C
;
Feng, MS
;
Tseng, WT
;
材料科學與工程學系
Chemical mechanical planarization (CMP) has become widely accepted for the planarization of device interconnect structures in deep submicron semiconductor manufacturing. Attractive features of CMP include (i) global planarization and (ii) low defect and contamination level. The main challenge of cleaning is to remove the residual particles as well as the metallic contamination. In this paper, a modified post-CMP clean up-multi-chemicals spray cleaning process-is addressed in detail. This new process has been successfully applied to both oxide and tungsten CMP cleaning. The process provides comparable defect performance and excellent removal of metallic contamination to the scrubbing process which has been widely accepted in current post-CMP cleaning usage. The new clean up development strategy also contributes to their low cost of ownership (Co0) and good process flexibility as well as the minimizing cross-contamination. (C) 1998 Elsevier Science S.A.
A study of subbands in AlGaN/GaN high-electron-mobility transistor structures using low-temperature photoluminescence spectroscopy
(2002-06-17)
Fang, CY
;
Lin, CF
;
Chang, EY
;
Feng, MS
;
材料科學與工程學系
Al0.15Ga0.85N/GaN high-electron-mobility transistor (HEMT) structures with various delta-doping concentrations and spacer thicknesses grown on sapphire by metalorganic chemical-vapor deposition are investigated. The Hall mobility is as high as 1333 cm(2)/V s at room temperature and 6330 cm(2)/V s at 77 K. Two-dimensional electron gas (2DEG) phenomena, which have not been clearly resolved in the literature, are observed by photoluminescence (PL) spectra at low temperature in this study. The PL spectra peaks of the interband transitions from 2DEG subbands to the valence band are in the range from 3.486 to 3.312 eV. The effects of the strain caused by different Al fractions of the top layer, and that of the spacer thickness on the 2DEG phenomena are discussed. Redshifts due to temperature variations for various HEMT structures are observed in 2DEG subbands and in the band-edge emission, which is believed to be evidence of interband transitions from 2DEG subbands to valence bands. (C) 2002 American Institute of Physics.
A study on electrochemical metrologies for evaluating the removal selectivity of AlCMP
(1999)
Chiu, SY
;
Hsu, JW
;
Tung, IC
;
Shih, HC
;
Feng, MS
The in-situ electrochemical measurements were performed for the Al and Ti disks in the various slurries under the polishing or static condition. The slurries used contained Al2O3 abrasive, phosphoric acid, citric acid and hydrogen peroxide. The results showed that the addition of H2O2 could help to form an effective passivating layer on the Al surface. Besides, the addition of H2O2 enhanced Al dissolution. The maximum corrosion potential drop between the abraded and non-abraded Al electrodes corresponded to the possible maximum polishing rate of Al. The novel equipment for in-situ galvanic measurements was designed for evaluating the Al/Ti galvanic couple. It was found that Al dissolution could be suppressed in the slurry with the addition of 6 vol% H2O2 at pH 4. As regards the Al/Ti removal selectivity, the polishing with the addition of 6 vol% H2O2 at pH 4 would mitigate the Al dishing, since the polishing and dissolution of Al could be suppressed while those of Ti could be enhanced.
A ULSI shallow trench isolation process through the integration of multilayered dielectric process and chemical-mechanical planarization
(1999-06-22)
Lin, CF
;
Tseng, WT
;
Feng, MS
;
Wang, YL
;
材料科學與工程學系
A multilayer thin film structure (SiO2/SiNx/SiO2) with a one-step chemical-mechanical polish (CMP) process is developed for shallow trench filling and planarization for ULSI devices in the quarter micron regime. By fine-tuning the plasma-enhanced chemical vapor deposition (PECVD) conditions we successfully modified the stoichiometry and other characteristics of the as-deposited SiNx and oxide films. As these film characteristics are changed, the CMP removal rate selectivity between sacrificial oxide and nitride stopper layer can also be adjusted. Correspondingly, the CMP process latitude for shallow trench isolation in 0.25 mu m memory devices can be broadened by sequentially depositing multilayered oxide and nitride films with adjustable characteristics and CMP removal rates. Dishing-free wide trench areas with excellent planarity can be achieved through the integration of the proposed multilayered PECVD oxide/nitride scheme and the one-step CMP process. (C) 1999 Elsevier Science S.A. All rights reserved.
AIGaN Schottky characteristics after hybrid photo-enhanced wet and inductively coupled plasma etch
(2001)
Huang, WJ
;
Fang, CY
;
Wong, JS
;
Lee, CS
;
Chang, EY
AlGaN Schottky contact characteristics after hybrid photo-enhanced wet etch and Inductively coupled plasma etch (ICP) is studied. AlGaN was grown by MOCVD on sapphire substrate. KOH solution and 100mW/cm(2) UV illumination by Hg are lamp was used for photo-enhanced wet etch. Gas mixture of Cl-2 and N-2 was used for ICP etch. The Schottky metal used in this study is Ni/Au (100nm/100nm) and the Ohmic metal used is Al (100nm). Typical etch rates are 0.28nm/min and 265nm/min with a roughness of 0.6nm and 1.17nm for wet and dry etch respectively. The ICP process etches more rapidly but the etched surfaces are rougher when compared to the wet-etch process. After ICP etch at 600 watt for 60sec, the schottky diode has an ideality factor n=2.6, and the barrier height phi(B)=0.65 eV However, for the ICP etched sample followed by photo-enhanced wet chemical etch for 30mins, the sample has an ideality factor n=0.99, and the barrier height phi(B)=0.86 eV, and the breakdown voltage is recovered from 4V to 7.5V The study indicates that the wet chemical etch can remove the damage caused by ICP etching. Overall, the hybrid dry/wet etch process is a high etch rate process and cause very low damages on the etched surface.
AIGaN/GaN HEMT sub-bands study using low-temperature photoluminescence
(2001)
Fang, CY
;
Lin, CF
;
Lee, CS
;
Chang, EY
;
Feng, MS
Al0.1Ga0.9N/GaN HEMTs (High Electron Mobility Transistor) structures with different delta-doping concentration and spacer thickness grown on sapphire by MOCVD are studied. The hall mobility is as high as 1333 cm(2)/V s. at room temperature and 6330 cm(2)/V s at 77 K. Obvious 2-DEG phenomena not clearly resolved in literatures before are observed by PL spectra measured at low temperature. The influences of delta-doping concentration and spacer thickness on the 2-DEG phenomena are discussed. Peaks red-shift of different HEMT structures due to temperature variation are observed in 2-DEG sub-bands as well as at the band-edge emission that is believed as a strong evidence of 2DEG sub-bands to valence bands transmission.
Analysis of influence of alkyl sources on deep levels in GaN by transient capacitance method
(1996-07-01)
Chen, JF
;
Chen, NC
;
Huang, WY
;
Lee, WI
;
Feng, MS
The transient capacitance method nas used to analyze GaN samples grown by low-pressure organometallic vapor phase epitaxy (OMVPE) with triethylgallium (TEGa) or trimethylgallium (TMGa) as the alkyl source. Two deep levels at 1.10 and 1.27 eV were observed in the TMGa sample, while a deep level at 0.60 eV was observed in the TEGa sample. Using light illumination, levels deeper than those above were investigated in TEGa and TMGa samples.
Analysis of influence of alkyl sources on deep levels in GaN by transient capacitance method
(1996-07-01)
Chen, JF
;
Chen, NC
;
Huang, WY
;
Lee, WI
;
Feng, MS
The transient capacitance method nas used to analyze GaN samples grown by low-pressure organometallic vapor phase epitaxy (OMVPE) with triethylgallium (TEGa) or trimethylgallium (TMGa) as the alkyl source. Two deep levels at 1.10 and 1.27 eV were observed in the TMGa sample, while a deep level at 0.60 eV was observed in the TEGa sample. Using light illumination, levels deeper than those above were investigated in TEGa and TMGa samples.
Aplication of plasma immersion ion implantation on seeding copper electroplating for multilevel interconnection
(2005-05-01)
Chiu, SY
;
Wang, YL
;
Chang, SC
;
Feng, MS
;
材料科學與工程學系
In this study, an effective seeding technology, plasma immersion ion implantation of palladium (PIII Pd), was proposed to achieve defect-free gap filling for copper electroplating (Cu-ECP). It was found that a threshold dosage (similar to 5.2 x 10(18) m(-2)) of PIII I'd was required to drive Cu-ECP and the dependence of Pd dosage on the implantation time was quasi-linear. The thickness of electroplated copper films increased as the Pd dosage increased. Too high a Pd dosage caused a rough copper film with high resistivity (> 10 mu Omega cm) while too low a I'd dosage resulted in an insufficient nucleation site for Cu-ECP, leading to poor film adhesion. In addition, a higher substrate bias of PIII was suggested to enhance the gap-filling capability of Cu-ECP and the Cu(111) formation of electroplated copper films. (c) 2004 Elsevier B.V. All rights reserved.
Characterization of anodic aluminum oxide film and its application to amorphous silicon thin film transistors
(1996-02-01)
Liang, CW
;
Luo, TC
;
Feng, MS
;
Cheng, HC
;
Su, D
AL(2)O(3)/SINx double-layered dielectric films suitable for large-size amorphous silicon thin film transistor liquid crystal displays (a-Si:H TFT LCD) have been prepared by anodization and plasma enhanced chemical vapor deposition (PECVD). Al2O3 films were formed at various pH values and volume ratio of water (H2O%) in the electrolyte. The optimal quality of Al2O3 film was achieved at pH = 6 and H2O% = 30. These high-quality Al2O3 films have denser structure, lower etching rate (90 Angstrom min(-1)) and smooth surface morphology after etching. The capacitors made of the anodization show a breakdown field as high as 7.8 MV cm(-1) and a low leakage current density of 10 nA cm(-2) at a dielectric field of 3 MV cm(-1). Furthermore, a-Si:H TFTs with Al gate and different gate dielectrics (Al2O3/SINx and SiNx) were also fabricated and evaluated. The TFTs with Al2O3/SiNx double-layered gate dielectric provide better performances, such as the smaller threshold voltage (1.76 V), improved subthreshold swing (1.0 V dec(-1)), and lower off-current (3.8 PA) than those of the device with single SiNx, film.
Characterization of excimer-laser-annealed polycrystalline silicon films grown by ultrahigh-vacuum chemical vapor deposition
(2000-10-16)
Chen, YC
;
Wu, YCS
;
Tung, IC
;
Chao, CW
;
Feng, MS
Polycrystalline silicon (poly-Si) films grown by ultrahigh-vacuum chemical vapor deposition (UHVCVD) system and then annealed by excimer laser at room temperature have been investigated for the applications in polycrystalline silicon thin-film transistors (poly-Si TFTs). The results showed that the grain size of the laser-annealed poly-Si film decreased with laser energy density when a lower laser energy density below 157.7 mJ/cm(2) was used. At about the threshold laser energy density (similar to 134.5 mJ/cm(2)), the finest grain structure could be obtained due to the partial melting in the top layer of the film. When the energy density of the excimer laser was larger than the threshold energy density, the large grain growth was initiated. The largest grain structure could be obtained at similar to 184 mJ/cm(2), while its surface roughness was better than that of the nonannealed UHVCVD poly-Si films. The surface roughening was suggested to arise from the specific melt-regrowth process but not the rapid release of hydrogen or capillary wave mechanism derived from laser-annealed amorphous silicon. By use of the laser-annealed UHVCVD poly-Si films as the active layer, the fabricated poly-Si TFT exhibited a field-effect mobility of 138 cm(2)/V s, a subthreshold swing of 0.8 V/dec, a threshold voltage of 3.5 V, and an on/off current ratio of similar to 10(6). (C) 2000 American Institute of Physics. [S0003- 6951(00)03842-0].
Characterization of GaN epitaxial layers on SiC substrates with AlxGa1-xN buffer layers
(1997-12-18)
Lin, CF
;
Cheng, HC
;
Feng, MS
;
Chi, GC
;
材料科學與工程學系
High quality GaN epitaxial layers were obtained with AlxGa1-xN buffer layers on 6H-SiC substrates. The low-pressure metalorganic chemical vapor deposition (LP-MOCVD) method was used. The 500 Angstrom thick buffer layers of AlxGa1-xN (0 less than or equal to x less than or equal to 1) were deposited on SiC substrates at 1025 degrees C. The FWHM of GaN (0004) X-ray curves are 2-3 arcmin, which vary with the Al content in AlxGa1-xN buffer layers. An optimum Al content is found to be 0.18. The best GaN epitaxial film has the mobility and carrier concentration about 564 cm(2) V-1 s(-1) and 1.6 x 10(17) cm(-3) at 300 K. The splitting diffraction angle between GaN and AlxGa1-xN were also analyzed from X-ray diffraction curves. (C) 1997 Elsevier Science S.A.
Chemical-mechanical polishing and material characteristics of plasma-enhanced chemically vapor deposited fluorinated oxide thin films
(1997-03-01)
Tseng, WT
;
Hsieh, YT
;
Lin, CF
;
Tsai, MS
;
Feng, MS
The chemical-mechanical polishing (CMP) process has been proven to be the most promising method for accomplishing global planarization. In this paper, results of chemical-mechanical polishing of fluorinated silicon dioxide (SiOF) thin films are presented. Nanohardness, elastic modulus, and bonding structure of fluorinated silicon dioxides are characterized in order to evaluate their correlations with CMP performance. The results show that under fixed chemistry and mechanical parameters, the CMP removal rate increases significantly with increasing fluorine content in the oxides due to the lower hardness and elastic modulus in the films. Higher CMP removal rate is observed for fluorinated oxides polished with slurry of pH 10 relative to pH 9. Compared with undoped oxides, SiOF films are more sentisitive to chemical and moisture attacks as reflected by the post-CMP increase in refractive index.
Chemical-mechanical polishing of low-dielectric-constant spin-on-glasses: film chemistries, slurry formulation and polish selectivity
(1997-10-31)
Wang, YL
;
Liu, C
;
Chang, ST
;
Tsai, MS
;
Feng, MS
Alkyl siloxane-based low-dielectric-constant (low-k) spin-on-glass (SOG) thin films with varying amounts of organic content were subjected to polishing experiments using silica-and ZrO2-based slurries with a variety of additives, As the amount of organic content in SOG increases, the chemical-mechanical polishing (CMP) removal rate decreases with silica-based potassium hydroxide-added slurry. On the other hand, zirconia-based slurry resulted in higher removal rates for both SOG (>400 nm/min) and thermal oxide and an adjustment in polish selectivity (related to thermal oxide) ranging from 1.2 to 9.1 can be achieved by adding various amounts of tetra-alkyl substituted ammonium hydroxide. Post-CMP materials characterization by Fourier transform infrared spectroscopy (FTIR) and atomic force microscopy (AFM) shows the chemical stability and CMP compatibility of SOG thin films. (C) 1997 Elsevier Science S.A.
Device characteristics of polysilicon thin-film transistors fabricated by electroless plating Ni-induced crystallization of amorphous Si
(2003-04-01)
Chao, CW
;
Wu, YCS
;
Hu, GR
;
Feng, MS
;
材料科學與工程學系
Compared with conventional solid phase crystallized (SPC) thin-film transistors (TFTs), metal-induced laterally crystallized (MILL) TFTs exhibit significantly enhanced performance. Metal films are usually deposited by the physical vapor deposition (PVD) method, which is time-consuming and expensive in terms of equipment cost. In this work, a simpler electroless plating Ni was introduced to replace PVD Ni. It was found that the morphologies and the device characteristics of Ni-induced lateral crystallization TFT were as good as those of PVD Ni-induced lateral crystallization TFT.
Effect of carrier gas on the structure and electrical properties of low dielectric constant SiCOH film using trimethylsilane prepared by plasma enhanced chemical vapor deposition
(2004-12-22)
Cheng, YL
;
Wang, Y
;
Lan, JK
;
Chen, HC
;
Lin, JH
For a low dielectric constant inter-metal dielectric application, the low-k SiCOH film with a dielectric constant of 2.8-3.2 has been deposited by plasma-enhanced chemical vapor deposition (PE-CVD) with trimethylsilane (3MS), oxygen, and the carrier gas. In this work, we present the effects of the carrier gas on the characterizations of the low-k films, including reaction mechanism, the deposition rate, and the mechanical and electrical properties. According to the experimental results, the low-k film in Ar carrier gas exhibits the improvement in deposition rate, nonuniformity, leakage current, and hardness. In addition, the dielectric constant of the deposited low-k film is slightly sacrificed due to the decrease of micropores in the deposited films. (C) 2004 Elsevier B.V. All rights reserved.
Effect of deposition temperature, on thermal stability in high-density plasma chemical vapor deposition fluorine-doped silicon dioxide
(2004-05-01)
Cheng, YL
;
Wang, YL
;
Chen, HW
;
Lan, JL
;
Liu, CP
Thermal stability of fluorine-doped silicon dioxide films deposited by high-density plasma chemical vapor deposition as a function of deposition temperature were investigated in this study. Both thermal desorption spectrum and annealing test results show that SiOF films deposited above 400 degreesC have better thermal stability. Furnace annealing data indicate that non -Si-F- bonding fluorine does exist in low-deposition-temperature SiOF films. Furthermore, secondary-ion mass spectrometer results also reveal that the fluorine in SiOF films with a lower-deposition temperature is easily diffused out and turned into the underlayer, which results in less thermally stable SiOF films. Moreover, short-loop simulation results have been subsequently tested and it was concluded that the deposition temperature of the SiOF film is extremely important for thermal stability. (C) 2004 American Vacuum Society.
Effect of surface passivation removal on planarization efficiency in Cu abrasive-free polishing
(2006)
Fang, JY
;
Tsai, MS
;
Dai, BT
;
Wu, YS
;
Feng, MS
Selective removal of surface passivation on protruded Cu film is a critical factor of Cu planarization. For a stress-free Cu abrasive-free polishing (Cu AFP) process, due to the lack of mechanical abrasion by abrasives, a polishing pad is used instead of abrasives to remove surface passivation during Cu planarization. Thus, the planarization efficiency in Cu AFP relates to the efficiency of surface passivation removed by a pad. Comparing Cu oxides with a non-native Cu-BTA (Cu-Benzotriazole) monolayer used as surface passivation, this study found that an oxide-free Cu surface should be required in Cu AFP. When Cu oxides function as surface passivation in Cu AFP, they are removed with greater difficulty by a pad resulting in low planarization efficiency. Contrary to Cu oxides, high planarization efficiency can be obtained with non-native Cu-BTA as surface passivation in Cu AFP. (c) 2005 The Electrochemical Society.