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Browsing by Author "Jin-Chern"

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    Control system for an electrostatically-driven microelectromechanical device
    (2004-02-03)
    Chiou
    ;
    Jin-Chern
    ;
    Lin
    ;
    Yu-Chen
    The present invention relates to a control system for an electrostatically-driven microelectromechanical device, which uses multiple electrodes to control the microelectromechanical device, i.e. the lower driven electrode of a capacitor with known two parallel driven electrodes is cut into a number of small electrodes. By selecting an electrode pattern for a desired electrostatic force, it is capable of altering the non-linearity of the device based on various applications and achieving a characteristic such as a linear driven, digital driven, or ultimately optimal driven manners, which is able to reach high operation accuracy for the existing circuit that only possesses a limited accuracy.
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    Integration structure of semiconductor circuit and microprobe sensing elements and method for fabricating the same
    (2011-01-25)
    Chiou
    ;
    Jin-Chern
    ;
    Chang
    ;
    Chih-Wei
    The present invention discloses an integration structure of a semiconductor circuit and microprobe sensing elements and a method for fabricating the same. In the method of the present invention, a semiconductor circuit is fabricated on one surface of a semiconductor substrate, and the other surface of the semiconductor substrate is etched to form a microprobe structure for detect physiological signals. Next, a deposition method is used to sequentially form an electrical isolated layer and an electrical conductive layer on the microprobes. Then, an electrical conductive material is used to electrically connect the electrical conductive layer with the electrical pads of the semiconductor circuit. Thus is achieved the integration of a semiconductor circuit and microprobe sensing elements in an identical semiconductor substrate with the problem of electric electrical isolated being solved simultaneously. Thereby, the voltage level detected by the microprobes will not interfere with the operation of the semiconductor circuit.
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    Method for fabricating microneedle array and method for fabricating embossing mold of microneedle array
    (2008-09-30)
    Chiou
    ;
    Jin-Chern
    ;
    Hung
    ;
    Chen-Chun
    ;
    Chang
    The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated.