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Browsing by Author "Ke-Shian"

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    Copper metalized ohmic contact electrode of compound device
    (2008-05-06)
    Lee
    ;
    Cheng-Shih
    ;
    Chang
    ;
    Edward Yi
    ;
    Chen
    The present invention provides an ohmic contact for a copper metallization whose heat diffusion is improved and cost is reduced. Therein, the ohmic contact is formed through a depositing and an annealing of three metal layers of Pd, Ge and Cu; and, the contact resistance of the ohmic contact is adjusted by the thicknesses of the three layers.