Browsing by Author "Lee, Chia-Lin"

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An Ultra-Fast Temporary Bonding and Release Process Based on Thin Photolysis Polymer in 3D Integration
(2015)
Tsai, Tsung-Yen
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Lin, Chien-Hung
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Lee, Chia-Lin
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Yang, Shan-Chun
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Chen, Kuan-Neng
An ultra-fast temporary bonding and release process was investigated for the improvement of 3D integration. The bonding scheme composes of two different kinds of polymer for release layer and adhesive layer. The submicron release layer is a positive photoresist with the characteristic of high UV absorption induced into the de-bonding procedure within 20 s. In addition, the adhesive layer provides robust mechanical strength for the wafer thinning process. Based on results, this structure is a potential candidate for temporary bonding and de-bonding technique in 3D integration.
Characterization of Temporary Bonding and Laser Release Using Polyimide and a 300-nm Photolysis Polymer System for High-Throughput 3-D IC Applications
(2017-03)
Cheng, Chuan-An
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Tsai, Tsung-Yen
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Huang, Yu-Hsiang
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Lin, Chien-Hung
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Lee, Chia-Lin
A new temporary bonding technology with an ultrafast laser-release process of less than 20 s is presented, where a 300-nm-thick photolysis polymer and polyimide are served as the release layer and adhesive layer, respectively. The submicrometer-thick polymer has the feature of high absorption of a 355-nm laser in contrast to polyimide during debonding procedures. In addition, the thin release layers of high chemical resistance and mechanical strength demonstrate their feasibility for handling process. Electrical characteristics of the devices before and after the laser-release process are investigated, showing no degradation. Thus, this technology scheme demonstrates its potential for temporary bonding and release in 3-D integration applications.
Enhancing device efficiencies of solid-state near-infrared light-emitting electrochemical cells by employing a tandem device structure
(2014-03-01)
Lee, Chia-Lin
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Cheng, Chia-Yu
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Su, Hai-Ching
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照明與能源光電研究所
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Institute of Lighting and Energy Photonics
Compared to near-infrared (NIR) organic light-emitting devices, solid-state NIR light-emitting electrochemical cells (LECs) could possess several superior advantages such as simple device structure, low operating voltages and balanced carrier injection. However, intrinsically lower luminescent efficiencies of NIR dyes and self-quenching of excitons in neat-film emissive layers limit device efficiencies of NIR LECs. In this work, we demonstrate a tandem device structure to enhance device efficiencies of phosphorescent sensitized fluorescent NIR LECs. The emissive layers, which are composed of a phosphorescent host and a fluorescent guest to harvest both singlet and triplet excitons of host, are connected vertically via a thin transporting layer, rendering multiplied light outputs. Output electro-luminescence (EL) spectra of the tandem NIR LECs are shown to change as the thickness of emissive layer varies due to altered microcavity effect. By fitting the output EL spectra to the simulated model concerning microcavity effect, the stabilized recombination zones of the thicker tandem devices are estimated to be located away from the doped layers. Therefore, exciton quenching near doped layers mitigates and longer device lifetimes can be achieved in the thicker tandem devices. The peak external quantum efficiencies obtained in these tandem NIR LECs were up to 2.75%, which is over tripled enhancement as compare to previously reported NIR LECs based on the same NIR dye. These efficiencies are among the highest reported for NIR LECs and confirm that phosphorescent sensitized fluoresce combined with a tandem device structure would be useful for realizing highly efficient NIR LECs. (C) 2014 Elsevier B. V. All rights reserved.
Feasibility Investigation of Amorphous Silicon as Release Layer in Temporary Bonding for 3-D Integration and FOWLP Scheme
(2017-03-01)
Cheng, Chuan-An
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Huang, Yu-Hsiang
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Lin, Chien-Hung
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Lee, Chia-Lin
;
Yang, Shan-Chun
A reliable temporary bonding scheme with both inorganic amorphous silicon release layer and HD-3007 polyimide based on high 355-nm-wavelength laser absorption coefficient in release layer is proposed and investigated. Effects of laser absorption coefficient and laser ablation path are also studied to develop a high throughput laser ablation process. The bonding scheme can be achieved within the optimized temperature of 210 degrees C under 1 MPa bonding force. In addition, chemical resistance, mechanical strength with reliability assessment, and thermal stability test for bonded structure are inspected. There is no obvious degradation in electrical characterization after laser ablation, indicating that the temporary bonding scheme has high potential to be used for 3-D integration applications.
PLASMONIC-ENHANCED POLYMER PHOTOVOLTAIC DEVICES INCORPORATING AU NANOPARTICLES
(2010)
Wu, Jyh-Lih
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Lee, Chia-Lin
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Chen, Fang-Chung
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Kuo, Chun-Hong
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Huang, Michael H.
We have improved the device performance of polymer photovoltaic devices (OPVs) by blending Au nanoparticles (NPs) into the anodic buffer layer. The unique optical properties of localized surface plasmon resonance (LSPR), triggered by Au NPs, was beneficial for improving the photocurrent of OPVs. The excitation of LSPR increased not only the exciton generation rate but also the exciton dissociation probability. As a result, the power conversion efficiency of OPVs has been significantly enhanced from 3.57 to 4.24%.
Study of a Novel Amorphous Silicon Temporary Bonding and Corresponding Laser Assisted De-bonding Technology
(2016)
Huang, Yu-Hsiang
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Liang, Hao-Wen
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Cheng, Chuan-An
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Lin, Chien-Hung
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Lee, Chia-Lin
A novel amorphous silicon temporary bonding and corresponding laser assisted de-bonding technology are investigated for the improvement of 3D integration. Excellent bonding results with real device wafer with alpha-IGZO thin-film transistor are shown at the bonding temperature of 210 degrees C, as well as outstanding performances for bonding strength, thermal stability, reliability and chemical resistance. Laser ablated amorphous silicon is proved stable and ultra-fast. Advantages of excellent bonding quality, lower cost and higher throughput demonstrate that this scheme can be a potential candidate in 3D integration platform.
The impacts of green claims on coffee consumers\' purchase intention
(2015-01-01)
Chen, Mei-Fang
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Lee, Chia-Lin
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經營管理研究所
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Institute of Business and Management
Purpose - As huge environmental impacts caused by the coffee industry are significant and controversial in the course from cultivation to consumption, the purpose of this paper is to investigate whether or not different types of green claims based on the product lifecycle can lead to different extents of green psychological variables including purchase intention. Design/methodology/approach - The green claims of Starbucks were chosen as the research target for this study not only because the coffee chain store is working on the "Starbucks" Shared Planet\' program, which makes a commitment to do business in ways that are good for people and the planet, but also because such a program can be categorized into three major green message elements on the basis of the product lifecycle. A total of 920 valid self-reported questionnaires collected in Taiwan were used for this empirical analysis. Findings - One-way ANOVA results reveal that all of the three green claims of Starbucks can lead to consumers building up the same level of green brand image of this company, with "ethical sourcing" significantly possessing more impacts on the other green psychological variables (i.e. green trust, green satisfaction, green brand equity, and green purchase intention). Practical implications - The empirical results and findings from this study are helpful to the coffee industry marketers if they, in formulating various promotion campaigns, can communicate with the consumers with an eye to increasing their green brand image and other green psychological variables, including green purchase intention. Originality/value - This study is among the first to introduce different types of green claims on a basis of the product lifecycle to examine whether or not consumers\' green psychological variables will be different.
The Influence of Device Morphology on Wafer-Level Bonding with Polymer-Coated Layer
(2016-01-01)
Liang, Hao-Wen
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Chen, Hsiu-Chi
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Lin, Chien-Hung
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Lee, Chia-Lin
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Yang, Shan-Chun
Thetolerance of device morphology in wafer-level bonding through polymer-coated layer was investigated for the application of 3D integration. Several different pillar heights were fabricated on wafers to simulate the case of bonding with real devices on wafers. Overall, the wafer morphology with polymer-coated layer above devices less than 2 mu m can achieve excellent bonding quality. Furthermore, undamaged carrier wafers can be obtained after laser-assisted de-bonding technology, and post clean treatment. Based on bonding results, this research can provide a practical concept on device morphology for polymer-based temporary wafer-level bonding in 3D integration.
Wafer-Level MOSFET with Submicron Photolysis Polymer Temporary Bonding Technology Using Ultra-Fast Laser Ablation for 3DIC Application
(2016)
Cheng, Chuan-An
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Huang, Yu-Hsiang
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Lin, Chicn-Hung
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Lee, Chia-Lin
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Yang, Shan-Chun
A submicron photolysis polymer temporary bonding with ultra-fast laser de-bonding process of less than 20 s has been demonstrated where both photolysis polymer and polyimide are served as release layer and adhesive layer, respectively. In addition, the bonded structure provides high chemical resistance and mechanical strength for handling process. By measuring the electrical characteristics of devices before and after de-bond, it shows promising performance without degradation. Thus it can be a potential candidate for temporary bonding and de-bonding in 3D integration.