Browsing by Author "Lee, Shyong"

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Ge/IIIV fin field-effect transistor common gate process and numerical simulations
(2017-04-01)
Chen, Bo-Yuan
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Chen, Jiann-Lin
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Chu, Chun-Lin
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Luo, Guang-Li
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Lee, Shyong
This study investigates the manufacturing process of thermal atomic layer deposition (ALD) and analyzes its thermal and physical mechanisms. Moreover, experimental observations and computational fluid dynamics (CFD) are both used to investigate the formation and deposition rate of a film for precisely controlling the thickness and structure of the deposited material. First, the design of the TALD system model is analyzed, and then CFD is used to simulate the optimal parameters, such as gas flow and the thermal, pressure, and concentration fields, in the manufacturing process to assist the fabrication of oxide-semiconductors and devices based on them, and to improve their characteristics. In addition, the experiment applies ALD to grow films on Ge and GaAs substrates with three-dimensional (3-D) transistors having high electric performance. The electrical analysis of dielectric properties, leakage current density, and trapped charges for the transistors is conducted by high-and low-frequency measurement instruments to determine the optimal conditions for 3-D device fabrication. It is anticipated that the competitive strength of such devices in the semiconductor industry will be enhanced by the reduction of cost and improvement of device performance through these optimizations. (C) 2017 Society of Photo-Optical Instrumentation Engineers (SPIE).
Interfacial characterization of nickel-yttria-stabilized zirconia cermet anode/interconnect joints with Ag-Pd-Ga active filler for use in solid-oxide fuel cells
(2015-01-21)
Chao, Chih-Long
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Chu, Chun-Lin
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Fuh, Yiin-Kuen
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Hsu, Ray-Quen
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Lee, Shyong
Nickel yttria-stabilized zirconia cermet anode (Ni-YSZ)/interconnect joints with silver palladium gallium (Ag-9Pd-9Ga) active fillers are prepared by vacuum brazing. The joint structure and microstructure are analyzed by X-ray diffraction (XRD) and scanning electron microscopy coupled with energy dispersive spectroscopy (SEWEDS), and by using an electron probe microanalyzer (EPMA). SEM observations of the joint show no cracks near the interface, confirming the compatibility of the Ag-9Pd-9Ga filler with a different anode and interconnect. The XRD pattern of the joint specimens oxidized at 800 degrees C for 250 h shows Cr2O3 and (Mn,Cr)(3)O-4 surface layers. EPMA analysis of the cell/Ag-9Pd-9Ga/alloys joint at the cross section shows Cr, O, Fe, Zr, Ni, Ag, Pd, Ga, Y, and Mn. Overall, the results indicate that the bonding between metal and cermet is well established and the interface is smooth. By correlating the XRD and EPMA analysis results, we also analyzed the possible stages during joint oxidation. The joint strength was evaluated at 25 and 800 degrees C under shear and tensile loading conditions, respectively, and the brazed Ag-9Pd-9Ga sealant compared favorably with the commercially available glass-ceramic GC-9 counterpart. Copyright (C) 2014, Hydrogen Energy Publications, LLC. Published by Elsevier Ltd. All rights reserved.
Joint strength of Ag-9Pd-9Ga brazed interconnect and anode-supported electrolyte for solid-oxide fuel cell applications
(2018-09-01)
Chao, Chih-Long
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Chu, Chun-Lin
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Fuh, Yiin-Kuen
;
Hsu, Ray-Quen
;
Lee, Shyong
A newly developed Ag-9Pd-9Ga active filler was vacuum brazed, and the mechanical properties between the metallic interconnects (SS430, Crofer22 APU, Crofer22 H) and a Ni-yttria-stabilized zirconia cermet anode were systematically investigated. The results indicate that the bonding between metal and cermet is well established and that the interface is smooth. The joint strength evaluated at both 25? and 800? under shear and tensile loading conditions confirmed that the brazed Ag-9Pd-9Ga sealant compared favorably with its commercially available glass-ceramic GC-9 counterpart.
The combination of rolling-and-T6-treatments with Al2O3-reinforcing-particles effect on A6061 metal-matrix composites
(2016-02-01)
Leu, Jyh-Shyan
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Chu, Chun-Lin
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Fuh, Yiin-Kuen
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Huang, E-Wen
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Lin, Kin-Fu
Al-Si alloys, with excellent properties such as low weight, low thermal expansion coefficient, and high wear-resistance, are ideal materials for the automobile and aerospace industries. However, their applications have been hampered by the coarsening of the primary-Si particles in Al-Si alloys. In this study, the rolling-and-T6-treatments effect on A6061/Al2O3 metal-matrix composites is investigated. The A6061/Al2O3 metal-matrix composites with different amounts of reinforcing Al2O3 particles are examined in the aspects of wear resistance and hardness. Upon the T6 treatment, the hardness is enhanced in all cases and is summarized. The results suggest that the increase of Al2O3 particles reduce the wear rate. The possible reinforce mechanisms and the environmental temperature effects are discussed. This improvement in wear resistance is due to the particle size refinement of silicon at a high percentage-roll-reduction.