Browsing by Author "Lin, Kung-Liang"
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Item type:Item, Broadband antireflection sub-wavelength structure of InGaP/InGaAs/Ge triple junction solar cell with composition-graded SiNx(2015-05) ;Chung, Chen-Chen ;Lo, Hsiao-Chieh ;Lin, Yen-Ku ;Yu, Hung-WeiBinh Tinh TranThis work reports a fabrication strategy to improve the antireflective ability of a InGaP/GaAs/Ge triple-junction solar cell, by combining a nano-templating technique and a chemical-synthesis approach. SiH4 and N-2 were used as ammonia-free reaction gases in a plasma-enhanced chemical vapor deposition (PECVD) to prepare Si3N4 as an original antireflective coating (ARC) layer with better chemical stability. Composition-graded SiNx was successfully integrated with sub-wavelength structure by modulating SiH4/N-2 ratio during PECVD deposition, and followed by a controllable gold-nanoparticle masking technique on top of the solar cell. Finite-difference time-domain solution was employed to simulate and optimize the aspect-ratio of the ARC, under the condition of variable refractive index over a broad wavelength window, and followed by the masking technique to obtain the desired ARC dimension. This enabled a low light reflectance (<10%) over a broad spectral bandwidth (300-1800 nm) for the solar cell with excellent stability, because of the triple advantages of structural optimization, better chemical stability and graded refractive index of the ARC. The solar cell\'s performance was tested and showed great competitiveness to those of forefront studies, suggesting the feasibility of the proposed technology.Item type:Item, Characterization of Al2O3/ZnO Grown on Si Substrate by Plasma Enhanced Atomic Layer Deposition(2013-01-01) ;Chung, Chen-Chen ;Tran, Binh-Tinh ;Lin, Kung-Liang ;Wang, Ching-ChiunChen, Chien-ChihCharacterization of nanolaminate Al2O3/ZnO oxide films grown on Si substrates was conducted by using plasma enhanced atomic layer deposition (PE-ALD) method. PE-ALD can minimize the structural imperfections in films and reduce substrate damage. The film deposition by using PE-ALD are dense, defect-free, highly uniform, conformal films and show excellent step coverage. Moreover, compared to other deposition techniques, it is possible to deposit high quality films at much lower temperatures. High resolution transmission electron microscope (TEM) images showed the existence of sharp interfacial layers among the Al2O3, ZnO layer, and the Si substrate for the growth rate of 1.56 angstrom/cycle, and the surface roughness of about 0.2 nm. The nanolaminate-stacking layer can be used in organic light emitting diode encapsulation application as the gas barrier.Item type:Item, Characterization of AlInN Layer Grown on GaN/Sapphire Substrate by MOCVD(2013-02-01) ;Huang, Wei-Ching ;Chang, Edward-Yi ;Wong, Yuen-Yee ;Lin, Kung-LiangHsiao, Yu-LinThe AlInN layers have been grown with different growth parameters on GaN/sapphire substrates by metal-organic chemical vapor deposition (MOCVD). The effects of growth parameters such as pressure and temperature on the Al incorporation during AlInN material growth have been investigated. The results showed that lower pressure provides a tendency for higher Al incorporating in the AlInN layer. Besides, as the temperature was increased from 700 degrees C to 780 degrees C, an estimation of 4% reduction on the indium composition has been observed for each 20 degrees C increment. XRD analysis showed that the best crystal quality of AlInN occured at 80% Al composition because of the higher lattice matching with GaN. Based on the above criteria, an Al0.8In0.2N/GaN HEMT device with 2 mu m gate length has also been fabricated. The DC characteristics showed a saturated current, I-dss of 280 mA/mm and transconductance of 140 mS/mm.Item type:Item, Characterizations of GaN Films Grown on Si (111) Substrates with Various Growth Temperatures of Multiple AlN Buffer Layers(2012) ;Binh-Tinh Tran ;Chang, Edward Yi ;Lin, Kung-Liang ;Luong, Tien-TungYu, Hung-WeiWe present the effect of multiple AlN buffer layers on characterizations of GaN film quality, which includes a thin high-low-high-temperature (HLHT) AlN buffer layers. The study is based on two different thicknesses of the GaN films on the buffers and found that the HLHT AlN buffer layers could significantly affect on the GaN films qualities. The buffer plays a very important role for the growth of GaN film on Si (111) substrate. The GaN film with an uniformly faceted surface and very high-quality has been obtained at the optimized multiple HLHT AlN buffer layers of 50-nm-thick at 1010-800-1010 degrees C.Item type:Item, Effect of Graded AlxGa1-xN Layers on the Properties of GaN Grown on Patterned Si Substrates(2012-02-01) ;Hsiao, Yu-Lin ;Lu, Lung-Chi ;Wu, Chia-Hsun ;Chang, Edward YiKuo, Chien-I2.2-mu m-thick crack-free GaN films were grown on patterned Si substrates. The crack-free GaN films were obtained by patterning Si substrate and optimizing the graded AlxGa1-xN layers. With the increase of the graded AlxGa1-xN layer thickness, the GaN crystal quality improved as judged from the X-ray diffraction data. By applying multi-AlxGa1-xN layers on the patterned Si substrate, a 31% reduction of tensile stress for the GaN film was obtained as measured by micro-Raman. For the AlGaN/GaN high electron mobility transistor grown on 1 x 1 cm(2) larger patterns, the device exhibits maximum drain current density of 776 mA/mm and maximum transconductance of 101 mS/mm. (c) 2012 The Japan Society of Applied PhysicsItem type:Item, Effect of Multiple AlN Layers on Quality of GaN Films Grown on Si Substrates(2014-11-01) ;Binh Tinh Tran ;Lin, Kung-Liang ;Sahoo, Kartika Chandra ;Chung, Chen-ChenChi-Lang NguyenIn this paper, we present the effect of multiple thin high-low-high-temperature AlN (HLHT AlN) nucleation layers on GaN film quality. A 1.9-mu m-thick GaN film gown on Si (111) substrate shows that the multiple HLHT AlN nucleation layers have a significant effect on GaN film quality. This process also plays a very important role in the growth of GaN films on Si (111) substrates. A high quality GaN film with a uniformly faceted surface with very low dislocation densities is obtained at the optimized multiple HLHT AlN nucleation layers 50-nm thick at a temperature of 1010-800-1010 degrees C and a growth pressure of 50 Torr.Item type:Item, Effect of the Circle-Grid Electrodes on Concentrated GaAs Solar Cell Efficiency(2014-09-01) ;Chung, Chen-Chen ;Binh Tinh Tran ;Han, Ming-Hung ;Lin, Kung-LiangYu, Hung-WeiIn this study, we investigate the effect of the shading factor of the front grid pattern on concentrated solar cell efficiency, taking the trade-off between the series resistance of the electrodes and the amount of incident light into consideration. We examine the thermal effect with regard to five different circle-grid electrode patterns of the front contact. The front contacts with different grid patterns affect the characteristics of light-concentrated-type GaAs single-junction solar cells. The device parameters analyzed include the open-circuit voltage (V-oc), short-circuit current (I-sc), fill factor (FF) and conversion efficiency (eta). The results of our study show that for a concentration ratio greater than 60x with AM1.5G, the device with a shading factor of 7.1% has the best cell efficiency of 27.05%, due to the smaller current crowding at the center spot. The results indicate that the conversion efficiency of solar cells can be improved by establishing a compromise between the shading effect and the series resistance effect.Item type:Item, Effects of Al(x)Ga(1-x)N interlayer for GaN epilayer grown on Si substrate by metal-organic chemical-vapor deposition(2010-05-01) ;Lin, Kung-Liang ;Chang, Edward-Yi ;Hsiao, Yu-Lin ;Huang, Wei-ChingLuong, Tien-TungGaN film grown on Si substrate using multilayer AlN/Al(x)Ga(1-x)N buffer is studied by the low-pressure metal-organic chemical-vapor deposition method. The Al(x)Ga(1-x)N films with Al composition varying from 1 to 0.66 were used to accommodate the stress induced between GaN and the Si substrate during GaN growth. The correlation of the Al composition in the Al(x)Ga(1-x)N films with respect to the stress induced in the GaN film grown was studied using high-resolution x-ray diffraction, including symmetrical and asymmetrical omega/2 theta scans and reciprocal space maps. It is found that with proper design of the Al composition in the Al(x)Ga(1-x)N buffer layer, crack-free GaN film can be successfully grown on 6 in. Si (111) substrates using multilayer AlN and Al(x)Ga(1-x)N buffer layers. (C) 2010 American Vacuum Society. [DOI: 10.1116/1.3385672]Item type:Item, Efficiency improvement of InGaP/GaAs/Ge solar cells by hydrothermal-deposited ZnO nanotube structure(2014-07-05) ;Chung, Chen-Chen ;Binh Tinh Tran ;Lin, Kung-Liang ;Ho, Yen-TengYu, Hung-WeiIn this paper, a zinc oxide (ZnO) nanotube, fabricated by the hydrothermal growth method on triple-junction (T-J) solar cell devices to enhance efficiency, is investigated. Compared to those of bare T-J solar cells (without antireflection (AR) coating) and solar cells with Si3N4 AR coatings, the experimental results show that the T-J solar cells, which use a ZnO nanotube as an AR coating, have the lowest reflectance in the short wavelength spectrum. The ZnO nanotube has the lowest light reflection among all experimental samples, especially in the range of 350 to 500 nm from ultraviolet (UV) to visible light. It was found that a ZnO nanotube can enhance the conversion efficiency by 4.9%, compared with a conventional T-J solar cell. The Si3N4 AR coatings also enhance the conversion efficiency by 3.2%.The results show that a cell with ZnO nanotube coating could greatly improve solar cell performances.Item type:Item, Evaluation of Cu-bumps with lead-free solders for flip-chip package applications(2009-12-01) ;Lin, Kung-Liang ;Chang, Edward-Yi ;Shih, Lin-Chi ;材料科學與工程學系Department of Materials Science and EngineeringLow cost electroplated Cu-bump with environmental friendly Sn solder was developed for flip-chip applications. The seed layer used was Ti/WN(x)/Ti/Cu where WN(x) was used as the Cu diffusion barrier and Ti was used to enhance the adhesion between bump and the chip pad. Thick negative photoresist (THB JSR-151N) with a high aspect ratio of 2.4 was used for electroplating of copper bump and Sn solder. The Sn solder cap was reflowed at 225 degrees for 6 min at N(2) atmosphere. No wetting phenomenon was observed for the Sn solder as evaluated by energy-dispersed spectroscopy (EDS). The Cu-bump with Ti/WN(x)/Ti/Cu seed layer not only have higher shear force than the Cu-bump with Ti/Cu seed layer but also has higher resistance to fatigue failure than the Au, SnCu, SnAg bumps. (C) 2009 Elsevier B.V. All rights reserved.Item type:Item, Fabrication and characterization of n-In0.4Ga0.6N/p-Si solar cell(2012-07-01) ;Tran, Binh-Tinh ;Chang, Edward-Yi ;Trinh, Hai-Dang ;Lee, Ching-TingSahoo, Kartika ChandraElectro-optic characteristics of a fabricated n-In0.4Ga0.6N/p-Si hetero-structure solar cell on Si substrate with Al and ITO (or Ti/Al/Ni/Au) materials for p and n-type contacts were investigated in this letter. The solar cell devices with ITO as n-type contacts were also compared to the solar cell using Ti/Al/Ni/Au as n-type contact in this study. High short-circuit current density observed for solar cell with ITO as n-type contacts due to the increased amount of light reaching the solar cell. The device with ITO contact exhibited an open-circuit voltage (V-oc) of 1.52 V and a short-circuit current density (J(sc)) of 8.68 mA/cm(2) with 54% fill factor. The conversion and external quantum efficiency (EQE) of the solar cell were 7.12 and 20.8%, respectively. Besides, a relationship between V-oc and In content in the InxGa1-xN alloys for this type of solar cell was also derived. (C) 2012 Elsevier B.V. All rights reserved.Item type:Item, Growth and Fabrication of GaN Light Emitting Diode on Patterned-Sapphire Substrate(2013-01-01) ;Binh-Tinh Tran ;Ming, Chen-Hauw ;Lin, Kung-Liang ;Chen, Hao-MingWang, Ching-ChianIn this study, the growth of GaN-films-based light emitting diodes (LEDs), have been clearly demonstrated on wet-etching patterned sapphire substrate (PSS) and conventional LEDs. The wet-etching PSS LED device showed a significantly higher performance than the conventional LED device. The wet-etching PSS LED device exhibited a leakage current of 9 mA under a bias of 8 V, an external quantum efficiency and output powers of 35.09 % and 19.23 mW under 20 mA injection current as compared to 12 mA, 27.23%, and 15.02 mW of the conventional LED device.Item type:Item, Growth of GaN film on 150 mm Si (111) using multilayer AlN/AlGaN buffer by metal-organic vapor phase epitaxy method(2007-11-26) ;Lin, Kung-Liang ;Chang, Edward-Yi ;Hsiao, Yu-Lin ;Huang, Wei-ChingLi, TingkaiHigh quality GaN film was successfully grown on 150 mm Si (111) substrate by metal-organic vapor phase epitaxy method using AlN multilayer combined with graded AlGaN layer as buffer. The buffer layer structure, film quality, and film thickness are critical for the growth of the crack-free GaN film on Si (111) substrate. Using multilayer AlN films grown at different temperatures combined with graded Al(1-x)Ga(x)N film as the buffer, the tensile stress on the buffer layer was reduced and the compressive stress on the GaN film was increased. As a result, high quality 0.5 mu m crack-free GaN epitaxial layer was successfully grown on 6 in. Si substrate. (C) 2007 American Institute of Physics.Item type:Item, Growth of GaN films on circle array patterned Si (111) substrates(2014-09-01) ;Lin, Kung-Liang ;Binh Tinh Tran ;Chung, Chen-Chen ;Chang, Edward-Yi材料科學與工程學系Low stress, low defect density GaN was successfully grown on circle array patterned Si (111) substrate using AlN as the buffer followed by two steps growth of the GaN film. Raman measurement shows a reduction of in plane biaxial stress for the GaN film grown on patterned substrate. The slight blueshifL of PL peaks further provides evidence that the tensile stress in the GaN film was relaxed, It is believed that the grain boundaries of the polycrystalline AlN buffer layer and the dislocations in the GaN film grown helped to relieve the stress induced by the lattice and the thermal coefficient mismatches during growth. (C) 2014 Elsevier By. All rights reserved.Item type:Item, Growth of High-Quality In(0.4)Ga(0.6)N Film on Si Substrate by Metal Organic Chemical Vapor Deposition(2011-11-01) ;Binh-Tinh Tran ;Chang, Edward-Yi ;Lin, Kung-Liang ;Wong, Yuen-YeeSahoo, Kartika ChandraHigh-quality In(0.4)Ga(0.6)N film grown on GaN/AlN/Si(111) templates was obtained by metal organic chemical vapor deposition (MOCVD) with negligible phase separation. A template of high-quality GaN grown on a Si(111) substrate using AlN buffer layers was used for subsequent In(0.4)Ga(0.6)N growth. The GaN layer was 0.6 mu m thick with rocking-curve full width at half maximum (FWHM) for a GaN(002) peak better than 430 arcsec. The In(0.4)Ga(0.6)N film grown was 0.3 mu m thick with a dislocation density of 6 x 10(7) cm(-2) and X-ray (omega-2 theta) FWHM better than 130 arcsec. (C) 2011 The Japan Society of Applied PhysicsItem type:Item, Growth of High-Quality In0.4Ga0.6N Film on Si Substrate by Metal Organic Chemical Vapor Deposition(2011-11-01) ;Binh-Tinh Tran ;Chang, Edward-Yi ;Lin, Kung-Liang ;Wong, Yuen-YeeSahoo, Kartika ChandraHigh-quality In0.4Ga0.6N film grown on GaN/AlN/Si(111) templates was obtained by metal organic chemical vapor deposition (MOCVD) with negligible phase separation. A template of high-quality GaN grown on a Si(111) substrate using AlN buffer layers was used for subsequent In0.4Ga0.6N growth. The GaN layer was 0.6 mu m thick with rocking-curve full width at half maximum (FWHM) for a GaN(002) peak better than 430 arcsec. The In0.4Ga0.6N film grown was 0.3 mu m thick with a dislocation density of 6 x 10(7) cm(-2) and X-ray (omega-2 theta) FWHM better than 130 arcsec. (C) 2011 The Japan Society of Applied PhysicsItem type:Item, Hydrothermal growth of ZnO nanotubes on InGaP/GaAs/Ge Solar Cells(2014-01-01) ;Chung, Chen-Chen ;Lin, Kung-Liang ;Yu, Hung-Wei ;Quan, Nguyen-HongDee, Chang-FuA new design where ZnO nanotubes were grown on the antireflection (AR) layer coated on triple-junction (T-J) solar cell devices to enhance the light conversion efficiency. Compared to the bare T-J solar cells (without an AR layer), the performance of Si3N4 AR coated solar cell showed improvement. The sample with a layer of ZnO nanotubes grown in top of AR layer showed the lowest light reflection compared with the bare and solely AR coated T-J solar cell especially in the spectrum range of 350-500 nm. The use of ZnO nanotubes have increased the conversion efficiency by 4.9% compared with the conventional T-J solar cell. While the Si3N4 AR coated sample only increased the conversion efficiency by 3.2%. This result is quite encouraging as further refinement and variation in the experiment procedures could possibly bring more exciting performance in the future.Item type:Item, MOVPE high quality GaN film grown on Si (111) substrates using a multilayer AlN buffer(2008) ;Lin, Kung-Liang ;Chang, Edward-Yi ;Huang, Jui-Chien ;Huang, Wei-ChingHsiao, Yu-LinHigh quality GaN films were successfully grown on Si (111) substrates using the MOVPE method and a multilayer AlN buffer. The buffer layer film quality and thickness are critical for the growth of the crack-free GaN film on Si (111) substrates. Cracks started to form on the single layer high temperature (HT) AlN film, grown on Si (111) substrate as the AlN thickness was greater than 20 nm. However, a 100 nm crack-free AlN film, can be obtained when multilayer buffer of HT-AlN/low temperature (LT)-AlN/HT-AlN was grown on the Si(111) substrate. By using multilayer AlN buffer, a 2 mu m crack-free GaN film was successful grown on the 2 '' Si (111) substrate. Moreover, the GaN film (2 mu m thick) grown on Si with a GaN (004) Mosaic FWHM of only 0.12 degrees.Item type:Item, Particle image velocimetry measurement of jet impingement in a cylindrical chamber with a heated rotating disk(2013-10-01) ;Liu, Yao-Hsien ;Tseng, Li-Wei ;Huang, Chih-Yung ;Lin, Kung-LiangChen, Chien-ChihWe studied the flow field of a jet impingement on a rotating heated disk to simulate the flow field surrounding the rotating disk of a chemical vapor deposition (CVD) reactor, which is widely used for large-scale production of thin-films and semiconductor materials. The flow field influences the growth rate and deposition uniformity, and is subject to the combined effects of buoyancy, centrifugal, and flow inertia forces that occur during the deposition process. The study investigated various flow-cell sizes and locations, such as the inlet flow-rate (1-10 slpm), jet-to-disk temperature difference (40-80 degrees C), and disk rotational speeds (0-500 rpm). Particle image velocimetry (PIV) was used to measure the flow-velocity field and flow-streamlines in the test chamber. The time-averaged axial and radial velocity profiles near the disk were used to determine the variations in flow velocity resulting from rotation and heating. Upward buoyancy forces, caused by the heated disk, produce flow cells and break the flow uniformity above the disk. When the rotational Reynolds number increases, the rotational effect eventually dominates the flow field that increases the flow velocity and generates flow cells near the chamber wall. Flow regime maps of these flow patterns were constructed, based on the Grashof number and rotational Reynolds number. (c) 2013 Elsevier Ltd. All rights reserved.Item type:Item, Pressure-Induced Phase Transitions in InAs Studied by Angular-Dispersive X-ray Diffraction and Raman Spectroscopy(2015-06-01) ;Lin, Chih-Ming ;Lin, Kung-Liang ;Chern, Yu-Ker ;Lin, Yu-KunChuang, Yu-ChunPressure-induced phase transitions in indium arsenide (In As) at ambient temperature were investigated by using angular-dispersive X-ray diffraction (ADXRD) and Raman scattering under high pressure up to around 9.8(1) and 9.9(2) GPa, respectively, with a 4:1 (in volume ratio) methanol-ethanol mixture as the pressure transmitting medium (PTM). In situ ADXRD measurements revealed that In As starts to transform from zinc blende (ZB) structure to rock-salt (RS) phase at 6.7(1) GPa, consistent with most previously reported studies. The phase transition proceeds steadily over a wide range of pressures and reaches completion at the highest applied pressure of 9.8 GPa with significant metallization, as suggested by the disappearance of Raman modes. In contrast to previous studies, our data did not show evidence of structural transition to Cnncm phase, presumably due to the different PTMs used and/or insufficient pressure applied. The order of appearance of the major diffraction peaks of RS phase In As with increasing pressure and intensity are explained by the binding energy density of the corresponding plane families. The zero-pressure isothermal bulk moduli (B-0) and its first-pressure derivatives (B-0\') for the ZB In As are 64(4) GPa and 3.8(2), respectively. The intensity of both the LO and TO phonon modes of ZB phase In As exhibits an abrupt decrease at 7.7(1) GPa, where equal weight fractions of ZB and RS phases are identified, suggesting the metallic nature of the RS phase.