Browsing by Author "Lin, MS"

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A generalisation of consecutive k-out-of-n : G systems
(2000-06-01)
Lin, MS
;
Chang, MS
;
Chen, DJ
;
資訊科學與工程研究所
;
Institute of Computer Science and Engineering
A generalized class of consecutive-k-out-of-n:G systems, referred to as Con/k*/n:G systems, is studied. A Con/k*/n:G system has n ordered components and is good if and only if ki good consecutive components that originate at component i are all good, where k(i) is a function of i. Theorem 1 gives an O(n) time equation to compute the reliability of a linear system and Theorem 2 gives an O(n(2)) time equation for a circular system. A distributed computing system with a linear (ring) topology is an example of such system. This application is very important, since for other classes of topologies, such as general graphs, planar graphs, series-parallel graphs, tree graphs, and star graphs, this problem has been proven to be NP-hard.
Accelerated ageing behavior of compatible IPNs based on epoxy and methacrylated epoxy resins
(1998)
Lin, MS
;
Wang, MW
;
Lee, CT
;
Shao, SY
;
應用化學系
Methacrylated diglycidyl ether of bisphenol A (MADGEBA) was synthesized from the reaction of the diglycidyl ether of bisphenol A (DGEBA) and methacrylic acid. The MADGEBA was blended with DGEBA in weight ratios of 100/0, 50/50 and 0/100, and cured simultaneously with dicumyl peroxide (DICUP) and hexahydrophthalic anhydride (HHPA) to obtain interpenetrating polymer networks (IPNs). The three samples were irradiated with ultraviolet in a Q-UVA weatherometer for various periods to study their ageing behavior. Experimental results indicate that the methacryloyl moiety thus incorporated confers significant stabilization against photodegradation. (C) 1998 Elsevier Science Limited. All rights reserved.
An efficient improvement for barrier effect of W-filled contact
(1996-02-01)
Yeh, WK
;
Chan, KY
;
Chang, TC
;
Tsai, MH
;
Chen, SH
A post chemical vapor deposition of tungsten (CVD-W) treatment by N-2 plasma is proposed to suppress the WAl12 formation during subsequent thermal annealing, which improves the thermal stability of W-filled contact. Selective CVD-W is employed to fill the contact hole. Following W deposition, in situ N-2 plasma treatment is performed prior to Al alloy metallization. It is shown that this post CVD-W treatment efficiently suppresses the formation of WAl12, resulting in an improvement of the barrier capability of W-filled contact.
Automatic construction of CSG solids from a single isometric drawing
(1996-01-01)
Wu, MC
;
Lin, MS
;
交大名義發表
;
工業工程與管理學系
;
National Chiao Tung University
This paper presents an algorithm for constructing a 3D workpiece in CSG (constructive solid geometry) representation from a single 2D isometric drawing. Currently, the concerned workpieces are limited to simple rectilinear polyhedra where any two faces or edges are either parallel or perpendicular to each other, however, the shape of constructed workpiece can further be modified by the application of a wireframe-based approach of variational geometry. Compared to previous relevant work, the proposed algorithm is distinguished by its capability to deal with degenerate 2D line drawings; that is, problems where two distinct edges are projected on to one line can be solved.
Characterization of BaPbO3 and Ba(Pb1-xBix)O-3 thin films
(2002-02-17)
Sun, CL
;
Wang, HW
;
Chang, MC
;
Lin, MS
;
Chen, SY
BaPbO3 and Ba(Pb1-xBix)O-3 films made from barium 2-ethylhexanoate, lead 2-ethylhexanoate and bismuth acetate were prepared by metal-organic deposition (MOD) method on Pt/Ti/SiO2/Si substrate. The phase transition and the physical properties of these films were studied. The polycrystalline BaPbO3 phase starts to form above 600 degreesC and the Pb-excess addition would enhance the formation of single perovskite BaPbO3 phase. With increasing annealing temperature, the optimum sheet resistance 1.6 Omega sq(-1) (resistivity approximate to 1.07 x 10(-4) Omega cm) could be obtained at 750 degreesC. However, an annealing temperature over 800 degreesC causes reactions between substrate and BaPbO3 phase and results in sharp increase of resistance. On the other hand, the substitution of Pb by Bi in the Ba(Pb1-xBix)O-3 films could stabilize the perovskite phase, though the sheet resistance is raised over 10 Omega sq(-1) at x = 0.3. (C) 2002 Elsevier Science B.V. All rights reserved.
Characterization of BaPbO3 and Ba(Pb1-xBix)O-3 thin films
(2003-02-17)
Sun, CL
;
Wang, HW
;
Chang, MC
;
Lin, MS
;
Chen, SY
BaPbO3 and Ba(Pb1-xBix)O-3 films made from barium 2-ethylhexanoate, lead 2-ethylhexanoate and bismuth acetate were prepared by metal-organic deposition (MOD) method on Pt/Ti/SiO2/Si substrate. The phase transition and the physical properties of these films were studied. The polycrystalline BaPbO3 phase starts to form above 600 degreesC and the Pb-excess addition would enhance the formation of single perovskite BaPbO3 phase. With increasing annealing temperature, the optimum sheet resistance 1.6 Omega sq(-1) (resistivity approximate to 1.07 x 10(-4) Omega cm) could be obtained at 750 degreesC. However, an annealing temperature over 800 degreesC causes reactions between substrate and BaPbO3 phase and results in sharp increase of resistance. On the other hand, the substitution of Pb by Bi in the Ba(Pb1-xBix)O-3 films could stabilize the perovskite phase, though the sheet resistance is raised over 10 Omega sq(-1) at x = 0.3. (C) 2002 Elsevier Science B.V. All rights reserved.
Comparisons of optical properties on meta- and para-linkages of copolymers for poly(phenylene vinylene) and poly(phenylene azomethine) with alkylthio group at the side chain
(2005-02-01)
Chang, CP
;
Wang, CC
;
Chao, CY
;
Lin, MS
;
應用化學系
Three series of soluble copolymers were synthesized: I, poly[m (or p)-phenylene (diacetonitrile) vinylene-co-methoxy-5-(2'-ethylhexylthio)-p-phynylene vinylene] (m-C=C(CN), p-C=C(CN)); II, poly[m (or p)-phenylene azomethine-co-2-methoxy-5-(2'-ethylhexylthio)-p-phenylene azomethine] (m-C=N, p-C=N); III, poly[m (or p)-phenylene vinylene-co-2-methoxy-5-(2'-ethylhexythio)-p-phenyle vinylene] (m-C=C, p-C=C). Of all these copolymers, the copolymers containing meta-linkage showed glass transition temperatures (T-g's) approximately 10 degrees C to 30 degrees C lower than those of the corresponding para-linkage copolymers because of lower crystallinity. 5% weight loss of all the copolymers occurred at around 381 to 344 degrees C. Copolymers of the meta-linkage also caused a relative asymmetry and irregularity of the copolymer main chain, thus leading to a decrease of effective conjugation length and a reduction of the molecular aggregation: this subsequently led to less excimer formation. These phenomena can be evidenced from the blue-shift of PL emission, 15 to 49 nm for the meta-linkage copolymers compared with the para-linkage copolymers. In addition, due to the lesser electron-donating capability of the sulfur atom, m-C=C, p-C=C and p-C=N containing the alkylthio group indicated a blue shift of 8 to 24 nm, when compared with those copolymers of similar structures containing the alkyloxy group as reported in the literature. Since series H contains strong electron-withdrawing -C=N- at the main chain, and series I contains even stronger electron-withdrawing cyano group, thus, the observed lambda(max) are in the order: series I [m-C=C(CN), p-C=C(CN)] > series II [mC=N, p-C=N] > series III [m-C=C, p-C=C]. Furthermore, since in series II, the lone pair electrons on the -C=N- main chain would overlap partially with the six pi electrons in the phenyl ring, and decrease the coplanar nature of the main chain, thus their PL emission intensities were less than those of series I and III. Finally, a device of the structure (ITO/PEDOT: PSS/m-CC(CN)/LiF/Al) was constructed, and a yellow light of lambda(max) = 570 nm was observed.
Curing behaviour of compatible interpenetrating polymer networks based on epoxy and methacrylated epoxy
(1997-12-01)
Wang, MW
;
Lee, CT
;
Lin, MS
;
應用化學系
;
Department of Applied Chemistry
Compatible interpenetrating polymer networks (IPNs) based on diglycidyl ether of bisphenol A (DGEBA) and methacrylated diglycidyl ether of bisphenol A (MADGEBA) in weight ratios of 100/0, 75/25, 50/50, 25/75 and 0/100 were blended and cured simultaneously by using dicumyl peroxide (DICUP) and hexahydrophthalic anhydride (HHPA) as curing agents. Fourier transform infrared spectroscopy (FTIR) was employed to investigate the intermolecular interactions and functional group changes. Viscosity increases during crosslinking were examined with a Brookfield viscometer. Curing exothermic peaks were studied with differential scanning calorimetry (DSC). The gel fractions of various IPN compositions were measured with a Soxhlet extractor. Samples thus prepared were checked for their compatibility by measuring glass transitions with DSC and damping peaks with rheometric dynamic spectroscopy (RDS). Experimental results revealed that good compatibility between components induced a network interlock, which subsequently resulted in incomplete cure of the IPN materials.
Deposition properties of selective tungsten chemical vapor deposition
(1996-09-01)
Yeh, WK
;
Chen, MC
;
Wang, PJ
;
Liu, LM
;
Lin, MS
This work investigates the basic deposition properties of selective tungsten chemical vapor deposition (W-CVD) using the process of silane reduction of WF6 with the SiH4/WF6 flow rate ratio less than 0.6 over the temperature range 280-350 degrees C. Selective W-CVD was performed on a contact hole patterned silicon substrate with in situ NF3 plasma etching of the silicon substrate prior to the selective tungsten deposition. The W deposition rate, deposition selectivity and W film resistivity were investigated with respect to the SiH4 partial pressure, WF6 partial pressure, total (SiH4 + WF6) deposition pressure, as well as the flow rate of the hydrogen carrier gas. It was found that the deposition rate is proportional to the SiH4 partial pressure, With a constant SiH4/WF6 flow rate ratio, the deposition rate increases with total pressure. At given flow rates of SiH4 and WF6, the deposition rate and film resistivity are dependent on the flow rate of the carrier gas. The experimental results show that the reverse bias junction leakage for the wet etching pretreated W/p(+)-n junction diode is smaller than that of the plasma pretreated diode. On the other hand, the contact resistance of the Al/W/n(+)p diode is smaller than that of the Al/W/p(+)n diode.
Differences in curing behavior of cocured and IPN materials
(2001-05-16)
Lin, MS
;
Chiu, CC
;
應用化學系
;
Department of Applied Chemistry
This study addressed the blending and cocuring of resole and epoxy, using NaOH and 4,4'-diaminodiphenylmethane as curing agents. IR band shifts regarding the molecular interactions were investigated with FTIR. Exothermic peak shifts during cocuring reactions were studied with dynamic DSC. Viscosity increases were measured with a Brookfield LVT viscometer at 100 degreesC. The dynamic mechanical properties of the cocured samples were investigated using rheometric dynamic spectroscopy (RDS). Experimental results revealed that the molecular interactions between resole and epoxy resulted in good compatibility as shown by the single damping peak in the RDS curve and the single glass transition for each cocured sample. Also apparent were accelerated curing rates, leading to shifts of the exothermic peaks to lower temperature and faster viscosity increases. Nevertheless, enhanced gel fractions and increased glass-transition temperatures (T-g) of the samples were generally observed for this cocured system. The average molecular weight between crosslinked points calculated for the cocured materials also showed much less than the two components. These curing behaviors were quite different from those of the Interpenetrating Polymer Network (IPN) materials, which usually indicated lowered gel fractions, decreased T-g, and higher average molecular weight between crosslinkings than for components. (C) 2001 John Wiley & Sons, Inc.
Distributed-program reliability analysis: Complexity and efficient algorithms
(1999-03-01)
Lin, MS
;
Chang, MS
;
Chen, DJ
;
資訊工程學系
;
Department of Computer Science
This paper investigates the problem of distributed-program reliability in various classes of distributed computing systems. This problem is computationally intractable for arbitrary distributed computing systems, even when it is restricted to the class of star distributed computing systems. One solvable case for star distributed computing systems is identified, in which data files are distributed with respective to a consecutive property; a polynomial-time algorithm is developed for this case. A linear-time algorithm is developed to test whether or not an arbitrary star distributed computing system has this consecutive file distribution property. Efficient algorithms may still be sought for computing lower & upper bounds on the distributed program reliability for arbitrary distributed computing systems.
Dynamic Java program corpus analysis - Part 1: The analyzer
(2001-05-01)
Hwang, CC
;
Chen, DJ
;
Huang, SK
;
Lin, MS
;
交大名義發表
Program corpus analysis is important in the optimization of runtime systems. Conventional linguistic analysis is static in nature and cannot reflect dynamic behaviors revealed by versatile object-oriented programming languages. We propose a pattern-based runtime profiler in this article. Unlike a conventional profiler or runtime visualization tools, representative program corpora accumulated and benchmarked not only shows monolithic functions that introduce excessive runtime overhead, hut also reflect their correlated code patterns, We propose a pattern-based analysis to address a program runtime bottleneck in a sequence of method invocations. It will reveal more semantic meanings in performance bottleneck rendered by object-oriented programming systems.
Dynamic Java program corpus analysis - Part 2: The control pattern analysis
(2001-06-01)
Hwang, CC
;
Chen, DJ
;
Huang, SK
;
Lin, MS
;
交大名義發表
Code patterns are statically recurring structures specific to a programming language, Control patterns are dynamically recurring structures invoked during program execution time, We have proposed a runtime profiler based on control patterns and demonstrate that all runtime traces can be represented by these patterns, A transformed form can be fed into a data-mining(1,2) analyzer(3) to find out if the recurring structures represent runtime behaviors.
Effect of surface pretreatment of submicron contact hole on selective tungsten chemical vapor deposition
(1996-01-01)
Yeh, WK
;
Chen, MC
;
Lin, MS
;
電子工程學系及電子研究所
;
Department of Electronics Engineering and Institute of Electronics
The effects of various predeposition treatments of silicon substrates on selective tungsten chemical vapor deposition were investigated using the silane reduction process. The predeposition treatments include HF or buffered HF wet etch and/or NF3 plasma etch. The experimental results show remarkable differences in the initial nucleation of W and the smoothness of the W surface and the W/Si interface among the various treatments, as revealed by scanning electron microscope inspection and atomic force microscope analysis. Plasma etch leads to a rough W/Si interface while wet treatment with HF dip results in a fairly smooth interface. The experimental results show that better I-V characteristics for the W/n-Si Schottky contact can be obtained by the wet etch treatment prior to the W deposition. The reverse bias junction leakage for the wet etch pretreated W/p(+)n junction diode is smaller than that of the plasma pretreated diode. In addition, the substrate surface treatments were found to result in Si consumption of various degrees. (C) 1996 American Vacuum Society.
Efficient algorithms for reliability analysis of distributed computing systems
(1999-07-01)
Lin, MS
;
Chang, MS
;
Chen, DJ
;
資訊工程學系
;
Department of Computer Science
A distributed computing system is modeled as a collection of resources (e.g. processing elements, data tiles and programs) interconnected via an arbitrary communication network and controlled by a distributed operating system, The distributed program reliability in a distributed computing system is the probability of successful execution of a program running on multiple processing elements and needs to retrieve data files from other processing elements. This reliability varies according to (1) the topology of the distributed computing system, (2) the reliability of the communication edges, (3) the data files and programs distribution among processing elements and (4) the data files required to execute a program. In addition, computing the reliability of distributed computing systems is #P-complete even when the distributed computing system is restricted to a series-parallel, a 2-tree, a tree, or a star structure. This paper presents efficient algorithms for computing the reliability of a distributed program running on other restricted classes of networks. (C) 1999 Elsevier Science Inc. All rights reserved.
Enhanced metalorganic chemical vapor deposition titanium nitride film fabricated using tetrakis-dimethylamino-titanium for barrier metal application in sub-half-micron technology
(1996-08-01)
Wang, CK
;
Liu, LM
;
Liao, M
;
Cheng, HC
;
Lin, MS
Enhanced metalorganic chemical vapor deposition (MOCVD) titanium nitride (TiN:C) film with low resistivity (< 700 mu Omega . cm) has been fabricated by thermal decomposition of tetrakis-dimethylamino-titanium (TDMAT; Ti[N(CH3)(2)](4)) Enhancement is carried out by in-situ N-2 plasma treatment of as-deposited TiN:C film and the enhanced TiN:C film has good stability: less than 4% increase in film resistivity after exposure to air for 24 days. The amount of oxygen absorbed in this enhanced TiN:C film after air exposure, determined by Auger electron spectroscopy (AES) was significantly reduced. This enhanced MOCVD TiN:C film has been successfully applied to sub-half-micron devices. A void-tree tungsten plug (W plug) for sub-half-micron holes can be achieved. Good barrier performance and low contact/via resistance have also been demonstrated.
Enhanced metalorganic chemical vapor deposition titanium nitride film fabricated using tetrakis-dimethylamino-titanium for barrier metal application in sub-half-micron technology
(1996-08-01)
Wang, CK
;
Liu, LM
;
Liao, M
;
Cheng, HC
;
Lin, MS
Enhanced metalorganic chemical vapor deposition (MOCVD) titanium nitride (TiN:C) film with low resistivity (< 700 mu Omega . cm) has been fabricated by thermal decomposition of tetrakis-dimethylamino-titanium (TDMAT; Ti[N(CH3)(2)](4)) Enhancement is carried out by in-situ N-2 plasma treatment of as-deposited TiN:C film and the enhanced TiN:C film has good stability: less than 4% increase in film resistivity after exposure to air for 24 days. The amount of oxygen absorbed in this enhanced TiN:C film after air exposure, determined by Auger electron spectroscopy (AES) was significantly reduced. This enhanced MOCVD TiN:C film has been successfully applied to sub-half-micron devices. A void-tree tungsten plug (W plug) for sub-half-micron holes can be achieved. Good barrier performance and low contact/via resistance have also been demonstrated.
Fluorescent conjugated polymer films as TNT chemosensors
(2004-08-13)
Chang, CP
;
Chao, CY
;
Huang, JH
;
Li, AK
;
Hsu, CS
Three prototypical light emitting conjugated polymers, two poly(p-phenylene vinylenes) (MEH-PPV and DP10-PPV) and a poly(diphenylacetylene), were examined for chemosensor applications to detect explosive compounds such as 2,4,6-trinitrotoluene (TNT) and 2,4- and 2,6-dinitrotoluene (DNTs). All polymer thin films showed high fluorescence quenching sensitivity towards TNT and DNTs, indicating that a wide range of emissive conjugated polymers are potentially useful chemosensor materials for detecting landmines. The relative sensitivity of fluorescence quenching of the polymers by the analytes has been rationalized in terms of the vapor pressure of the analytes, the solubility parameters of the polymers and the analytes, and the relative energy levels of the polymers. (C) 2004 Elsevier B.V. All rights reserved.
Kinetic study on epoxy bisphenol-A diacrylate IPN formation
(1999-12-01)
Lin, MS
;
Wang, MW
;
應用化學系
;
Department of Applied Chemistry
Interpenetrating polymer networks (IPN) based on diglycidyl ether of bisphenol-A (DGEBA) and bishenol-A diacrylate (BADA) in weight ratios of 100/0, 50/50, and 0/100 were blended and were cured simultaneously by using benzoyl peroxide (BPO) and 4,4'-methylenedianiline (MDA) as curing agents. Kinetic study during IPN formation was carried out at 65, 70, 75 and 80 degrees C. Absorbance changes at 1623.3 cm(-1) and 914 cm(-1) relating to concentration changes of C=C and epoxide were monitored with Fourier-transform infrared spectroscopy (FTIR). The epoxide cure kinetic data revealed a combination of non-catalytic bimolecular reaction and a catalyzed termolecular reaction, while the C=C cure kinetic data fitted a first-order reaction. The calculated kinetic parameters indicated decreased rate constants and increased activation energies of the IPN compared with those of the individual components. Presumably, chain entanglements between the two networks provide a sterically hindered environment for the cure reactions and vitrification restrains the chain mobility, accounting for the kinetic parameters. (C) 1999 Society of Chemical Industry.
Mechanical behaviours of fully and semi-interpenetrating polymer networks based on epoxy and acrylics
(1997-01-01)
Lin, MS
;
Lee, ST
;
交大名義發表
;
應用化學系
;
National Chiao Tung University
Fully interpenetrating polymer networks (fully IPNs) based on diglycidyl ether of bisphenol A (DGEBA) and ethylene dimethacrylate (EDMA) were prepared using isophronediamine and benzoyl peroxide as curing agents. Semi-interpenetrating polymer networks (semi-IPNs) based on DGEBA and 2-hydroxyethyl methacrylate (HEMA) were also prepared using the same curing agents. The average activation energies of transition for both these IPNs were calculated from rheometric dynamic spectroscopy (r.d.s.) data, which indicated higher values for the fully IPNs than the corresponding semi-IPNs. The more acrylic the interpenetrating polymer network (both fully and semi-IPNs) contained the lower the activation energy of transition. Broadened tan 6 peaks were observed for compatible materials, implying an enhanced cracking energy absorption. RDS data also revealed a maximum half-width of tan 6 at 30% of EDMA for the fully IPNs and at 25% of HEMA for the semi-IPNs. Beyond these compositions, decreased impact resistance and lower tensile modulus and elongation values were observed for these materials, presumably because of microphase-separation. Copyright (C) 1996 Elsevier Science Ltd.