Browsing by Author "Lin, Mao-Hsing"
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Item type:Item, Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD(2009) ;Chang, Chin-Cheng ;Leu, Jihperng ;Lin, Mao-Hsing ;Huang, Kun-Feng材料科學與工程學系Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.Item type:Item, Effects of localized warpage and stress on chip-on-glass packaging: Induced light-leakage phenomenon in mid-sized TFT-LCD(2012-01-01) ;Leu, Jihperng ;Chang, Chin-Cheng ;Chen, Alexander ;Lin, Mao-HsingHuang, Kun-FengMura defects become visible in a 13.3-in. TFT-LCD using chip-on-glass (COG) packaging when the thickness of the glass substrate is decreased from 0.5 to 0.3 mm. Mura, the non-uniform brightness in LCDs, is caused by COG packaging due to the mismatch of the coefficient of thermal expansion (CTE) and Young's modulus between the glass substrate and the IC-driver Si chips. In this paper, a 3-D finite-element-analysis (FEA) model, coupled with transient thermal analysis is first established to examine the warpage and stress behavior in the upper-glass-plate post-COG-package processing for identifying the root causes of the light-leakage phenomenon. Prior to that, the simulated warpage results are validated by surface-contour measurement. Data and modeling results show that a low bonding temperature together with a low modulus in novel ACF materials can effectively eliminate Mura. Besides, thinner silicon or a shorter length of Si chips as drivers offers enhanced reduction in the localized warpage, and thus can be a practical and low-cost solution for eliminating mura defects.Item type:Item, Investigation of Liquid Crystal Ripple Using Ericksen-Leslie Theory for Displays Subject to Tactile Force(2013) ;Lee, Y. J. ;Liu, T. S. ;Lin, Mao-Hsing ;Huang, Kun-Feng機械工程學系Liquid crystal display panels subjected to tactile force will show ripple propagation on screens. Tactile forces change tilt angles of liquid crystal molecules and alter optical transmission so as to generate ripple on screens. Based on the Ericksen-Leslie theory, this study investigates ripple propagation by dealing with tilt angles of liquid crystal molecules. Tactile force effects are taken into account to derive the molecule equation of motion for liquid crystals. Analytical results show that viscosity, tactile force, the thickness of cell gap, and Leslie viscosity coefficient lead to tilt angle variation. Tilt angle variations of PAA liquid crystal molecules are sensitive to tactile force magnitudes, while those of 5CB and MBBA with larger viscosity are not. Analytical derivation is validated by numerical results.Item type:Item, Study of LC Ripple Caused by Tactile Force Acting on Display(2012-01-01) ;Lee, Y. J. ;Liu, T. S. ;Lin, Mao-Hsing ;Huang, Kun-Feng機械工程學系Liquid crystal display (LCD) panels subjected to tactile force will show ripple propagation on screens. The Ericksen-Leslie theory is used to investigate ripple propagation that results from liquid crystal molecule tilt. Tactile-force effects are taken into account to derive the molecule equation of motion for liquid crystals.