Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD

Abstract

Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.