Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD
| dc.citation.epage | 841 | en_US |
| dc.citation.spage | 838 | en_US |
| dc.contributor.author | Chang, Chin-Cheng | en_US |
| dc.contributor.author | Leu, Jihperng | en_US |
| dc.contributor.author | Lin, Mao-Hsing | en_US |
| dc.contributor.author | Huang, Kun-Feng | en_US |
| dc.contributor.department | 材料科學與工程學系 | zh_TW |
| dc.contributor.department | Department of Materials Science and Engineering | en_US |
| dc.date.accessioned | 2014-12-08T15:41:54Z | |
| dc.date.available | 2014-12-08T15:41:54Z | |
| dc.date.issued | 2009 | en_US |
| dc.description.abstract | Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed. | en_US |
| dc.identifier.journal | 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/28498 | |
| dc.identifier.wosnumber | WOS:000272997600217 | |
| dc.language.iso | en_US | en_US |
| dc.title | Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD | en_US |
| dc.type | Proceedings Paper | en_US |
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