標題: | Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD |
作者: | Chang, Chin-Cheng Leu, Jihperng Lin, Mao-Hsing Huang, Kun-Feng 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 2009 |
摘要: | Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed. |
URI: | http://hdl.handle.net/11536/28498 |
期刊: | 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III |
起始頁: | 838 |
結束頁: | 841 |
顯示於類別: | 會議論文 |