標題: Effects of Localized Warpage and Stress on Chip-on-Glass Packaging Induced Light Leakage Phenomenon in 13-inch TFT-LCD
作者: Chang, Chin-Cheng
Leu, Jihperng
Lin, Mao-Hsing
Huang, Kun-Feng
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 2009
摘要: Mura defect induced by chip-on-glass packaging in 13-inch LCD-TFT was investigated using contour measurement and numerical analysis. Excellent correlation between Mura defect and localized warpage/principal stress has been established Besides, the effects of ACF bonding temperatures and Si chip arrangement on Mura defect were studied and discussed.
URI: http://hdl.handle.net/11536/28498
期刊: 2009 SID INTERNATIONAL SYMPOSIUM DIGEST OF TECHNICAL PAPERS, VOL XL, BOOKS I - III
起始頁: 838
結束頁: 841
顯示於類別:會議論文