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Browsing by Author "Liu, Hong-Che"

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    Low temperature polyimide-to-polyimide direct bonding
    (2019-01-01)
    Liu, Hong-Che
    ;
    Chen, Chih
    ;
    材料科學與工程學系
    ;
    Department of Materials Science and Engineering
    In this study, two polyimide (PI) films were bonded at 250/300 degrees C for 60 min. A good bonding interface with few voids was observed. During the bonding process, the partial cured PI film still underwent cross-linking reaction, resulting the voids in bonding sample..