Browsing by Author "Suen, SC"

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Characteristics of fluorinated amorphous carbon films and implementation of 0.15 mu m Cu/a-C : F damascene interconnection
(2001-05-01)
Shieh, JM
;
Suen, SC
;
Tsai, KC
;
Dai, BT
;
Wu, YC
Fluorinated amorphous carbon films (a-C:F) deposited by plasma enhanced chemical vapor deposition with low dielectric constant (K similar to2.3), thermal stability (higher than 400 degreesC) and acceptable adhesion to a cap layer such as SiOF or SiO2 were obtained by varying the range of content ratios between carbon and fluorine, the rf power, the process pressure and the base temperature. Standard x-ray photoelectron spectroscopy and thermal desorption spectroscopy metrologies were employed to characterize the deposited a-C:F films. The damascene pattern with 0.15 mum and an etching selectivity of more than 50 (a-C:F/SiOF, SiO2) was implemented by a mixture of etching gases of N-2+O-2. The bias power, rf power and gas hows were incorporated to optimize the etching recipe for achieving a damascene profile with a high aspect ratio. The scanning electron microscope results showed that a better etch profile can be obtained at higher bias power. In our damascene architecture, the etching stop layer or hard mask of both SiOF and SiO2 was studied. The SiOF, providing a lower dielectric constant than SiO2, would especially reduce the entire effective dielectric constant. Furthermore, we integrated electroplated copper into trenches or vias as small as 0.15 mum, with aspect ratio of 6. (C) 2001 American Vacuum Society.
Characterization of hydrogen-treated pentacene organic thin film transistors
(2004-04-01)
Yang, JY
;
Suen, SC
;
Whang, WT
;
材料科學與工程學系
;
Department of Materials Science and Engineering
The electrical characteristics of hydrogen-postannealed and hydrogen-plasma-treated pentacene thin film transistors (TFTs) have been investigated. Experimental results have shown that the hydrogen-treated TFTs have improved field-effect mobility and a higher current on/off ratio, compared to untreated devices. The on/off current ratio of the hydrogen-treated devices was markedly increased. However, the TFTs treated with hydrogen plasma have degraded field-effect mobility, compared to hydrogen-postannealed devices.
Low-temperature fabrication of carbon nanofibers by self-assembling of polycyclic aromatic hydrocarbon molecules
(2004-04-19)
Suen, SC
;
Whang, WT
;
Wu, BW
;
Lai, YF
;
材料科學與工程學系
Carbon nanofibers (CNFs) with diameter similar to66 nm have been synthesized from coronene by low-temperature (similar to45 degreesC) vacuum sublimation without the aid of a catalyst. Our method makes use of the property of polycyclic aromatic hydrocarbon (PAH) molecules, which can self-assemble into columnar aggregates. This polycyclic aromatic hydrocarbon-carbon nanofibers (PAH-CNFs) reveal much better thermal stability than commercial carbon nanotubes and exhibit field-emission characteristics with the onset of an electric field of 5.4 V/mum and field enhancement factor of 1326 cm(-1) for 100 mum interelectrode distance. The relative high thermal stability and easier process open up a possibility to fabricate large-scale field-emission devices in an efficient way and to provide a broad range of applications in nanoscience and technology. (C) 2004 American Institute of Physics.
Technology of electroplating copper with low-K material a-C : F for 0.15 mu m damascene interconnection
(2000)
Shieh, JM
;
Suen, SC
;
Lin, KC
;
Chang, SC
;
Dai, BT
In our work, fluorinated amorphous carbon films (a-C:F) was deposited by PECVD. The amorphous carbon films (a-C:F) with low dielectric constant (K similar to2.3), thermal stability (higher than 400 degreesC) and acceptable adhesion to cap-layer such as SiOF was obtained by optimum of content ration between carbon with fluorine and adding few SiH4 for improvement of adhesion. The etching profile with high aspect ratio and etching selection ration more than 50 (a-C:F/SiOF) were obtained by etching gas of N-2+O-2. Furthermore, we demonstrated the technology of electroplating copper in trenches or vias as small as 0.15 mum, 6:1 AR The wetting agent system was consisted of mainly two molecular weights polyethylene glycols (PEG). The small molecular weight PEG (200) with better diffusion ability for reducing the surface tension and the larger PEG (2000) enhancing grain growth control was proposed for the first time to wet the inner portion of the sub-150 nm damascene feature. The leveling agent system was mainly heterocyclic compound contained N, S atoms offering sufficient activation over-potential and selective inhibition gradient.