Browsing by Author "Trinh, Hai-Dang"

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Effect of annealing processes on the electrical properties of the atomic layer deposition Al2O3/In0.53Ga0.47As metal oxide semiconductor capacitors
(2014-04-01)
Quang-Ho Luc
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Chang, Edward Yi
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Trinh, Hai-Dang
;
Hong-Quan Nguyen
;
Binh-Tinh Tran
The influence of different annealing processes including post deposition annealing (PDA) and post metallization annealing (PMA) with various temperatures (250-400 degrees C) and ambient [N-2 and forming gas (FG)] on the electrical characteristics of Pt/Al2O3/In0.53Ga0.47As MOSCAPs are systemically studied. Comparing to samples underwent high PDA temperature, the higher leakage current has been observed for all of samples underwent high PMA temperature. This has resulted in the degradation of capacitance-voltage (C-V) behaviors. In conjunction with the current-voltage (J-V) measurement, depth profiling Auger electron spectroscopy (AES) and high-resolution transmission electron microscopy (HRTEM) analyses evidence that the out-diffusion of metal into oxide layer is the main source of leakage current. The noticeable passivation effect on the Al2O3/InGaAs interface has also been confirmed by the samples that underwent PDA process. (C) 2014 The Japan Society of Applied Physics
Effect of Nitridation on the Regrowth Interface of AlGaN/GaN Structures Grown by Molecular Beam Epitaxy on GaN Templates
(2012-08-01)
Wong, Yuen-Yee
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Huang, Wei-Ching
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Trinh, Hai-Dang
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Yang, Tsung-Hsi
;
Chang, Jet-Rung
AlGaN/GaN structures were regrown on GaN templates using plasma- assisted molecular beam epitaxy (PA-MBE). Prior to the regrowth, nitridation was performed using nitrogen plasma in the MBE chamber for different durations (0 min to 30 min). Direct-current measurements on high-electron-mobility transistor devices showed that good pinch-off characteristics and good interdevice isolation were achieved for samples prepared with a 30-min nitridation process. Current-voltage measurements on Schottky barrier diodes also revealed that, for samples prepared without nitridation, the reverse-bias gate leakage current was approximately two orders of magnitudes larger than that of samples prepared with a 30-min nitridation process. The improvement in the electrical properties is a result of contaminant removal at the regrowth interface which may be induced by the etching effect of nitridation.
Effect of Postdeposition Annealing Temperatures on Electrical Characteristics of Molecular-Beam-Deposited HfO2 on n-InAs/InGaAs Metal-Oxide-Semiconductor Capacitors
(2012-02-01)
Trinh, Hai-Dang
;
Lin, Yueh-Chin
;
Wang, Huan-Chung
;
Chang, Chia-Hua
;
Kakushima, Kuniyuki
The electrical characteristics of molecular-beam-deposited HfO2/n-InAs/InGaAs metal-oxide-semiconductor capacitors with different postdeposition annealing (PDA) temperatures (400-550 degrees C) are investigated. Results show that the sample with the PDA temperature of 500 degrees C exhibits the best capacitance-voltage (C-V) behavior with small frequency dispersion and small hysteresis. The X-ray photoelectron spectroscopy (XPS) spectra show the reduction of the amount of As-related oxides to below the XPS detection level when the PDA temperature is up to 500 degrees C. As the PDA temperature was increased to above 500 degrees C, As and In atoms seem to diffuse significantly into HfO2, resulting in the degradation of C-V behavior. (C) 2012 The Japan Society of Applied Physics
Effective surface treatment for GaN metal-insulator-semiconductor high-electron-mobility transistors using HF plus N-2 plasma prior to SiN passivation
(2016-01-01)
Liu, Shih-Chien
;
Trinh, Hai-Dang
;
Dai, Gu-Ming
;
Huang, Chung-Kai
;
Dee, Chang-Fu
An effective surface cleaning technique is demonstrated for the GaN metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) passivation process. In this study, dilute HF solution and in situ N-2 plasma treatments were adopted to remove the native oxide and recover the nitrogen-vacancy defects at the GaN surface before device passivation. To investigate the correlation between the properties of the SiN/GaN interface and the device performance, the GaN MIS-HEMTs were characterized using current-voltage (I-V) measurement, capacitance-voltage (C-V) measurement, and X-ray photoelectron spectroscopy (XPS) analysis. With the application of this surface treatment technique, the device exhibits improved I-V characteristics with low leakage current, low dynamic ON-resistance, and good C-V response with a steep slope. Overall, the results reveal that the oxide-related bonds and nitrogen-vacancy defects at the SiN/GaN interface are the root cause of the GaN MIS-HEMTs performance degradation. (C) 2016 The Japan Society of Applied Physics
Effective surface treatment for GaN metal-insulator-semiconductor high-electron-mobility transistors using HF plus N-2 plasma prior to SiN passivation
(2016-01)
Liu, Shih-Chien
;
Trinh, Hai-Dang
;
Dai, Gu-Ming
;
Huang, Chung-Kai
;
Dee, Chang-Fu
An effective surface cleaning technique is demonstrated for the GaN metal-insulator-semiconductor high-electron-mobility transistor (MIS-HEMT) passivation process. In this study, dilute HF solution and in situ N-2 plasma treatments were adopted to remove the native oxide and recover the nitrogen-vacancy defects at the GaN surface before device passivation. To investigate the correlation between the properties of the SiN/GaN interface and the device performance, the GaN MIS-HEMTs were characterized using current-voltage (I-V) measurement, capacitance-voltage (C-V) measurement, and X-ray photoelectron spectroscopy (XPS) analysis. With the application of this surface treatment technique, the device exhibits improved I-V characteristics with low leakage current, low dynamic ON-resistance, and good C-V response with a steep slope. Overall, the results reveal that the oxide-related bonds and nitrogen-vacancy defects at the SiN/GaN interface are the root cause of the GaN MIS-HEMTs performance degradation. (C) 2016 The Japan Society of Applied Physics
Effects of Wet Chemical and Trimethyl Aluminum Treatments on the Interface Properties in Atomic Layer Deposition of Al(2)O(3) on InAs
(2010-11-01)
Trinh, Hai-Dang
;
Chang, Edward Yi
;
Wong, Yuen-Yee
;
Yu, Chih-Chieh
;
Chang, Chia-Yuan
The reduction of native oxides on an In As surface using various wet and dry chemical treatments including hydrochloric acid (HCl) treatment sulfide treatment and in situ trimethyl aluminum (TMA) treatment before the atomic layer deposition (ALD) of Al(2)O(3) on In As is studied X ray photoelectron spectrum (XPS) results show that the effect of surface cleaning by TMA was apparent almost after the first pulse but that TMA cleaning is not as effective as wet chemical surface cleaning The combination of wet chemical treatment and TMA pretreatment is the most effective method for In As surface cleaning as indicated by the XPS analysis Capacitance-voltage (C-V) and current density-voltage (J-V) characteristics on metal-oxide-semiconductor capacitance (MOSCAP) structures were also investigated to evaluate the Al(2)O(3)/n In As interface quality after different surface treatments and the results are consistent with the XPS analysis (C) 2010 The Japan Society of Applied Physics
Effects of Wet Chemical and Trimethyl Aluminum Treatments on the Interface Properties in Atomic Layer Deposition of Al2O3 on InAs
(2010-11-01)
Trinh, Hai-Dang
;
Chang, Edward Yi
;
Wong, Yuen-Yee
;
Yu, Chih-Chieh
;
Chang, Chia-Yuan
The reduction of native oxides on an In As surface using various wet and dry chemical treatments including hydrochloric acid (HCl) treatment sulfide treatment and in situ trimethyl aluminum (TMA) treatment before the atomic layer deposition (ALD) of Al2O3 on In As is studied X ray photoelectron spectrum (XPS) results show that the effect of surface cleaning by TMA was apparent almost after the first pulse but that TMA cleaning is not as effective as wet chemical surface cleaning The combination of wet chemical treatment and TMA pretreatment is the most effective method for In As surface cleaning as indicated by the XPS analysis Capacitance-voltage (C-V) and current density-voltage (J-V) characteristics on metal-oxide-semiconductor capacitance (MOSCAP) structures were also investigated to evaluate the Al2O3/n In As interface quality after different surface treatments and the results are consistent with the XPS analysis (C) 2010 The Japan Society of Applied Physics
Fabrication and characterization of n-In0.4Ga0.6N/p-Si solar cell
(2012-07-01)
Tran, Binh-Tinh
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Chang, Edward-Yi
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Trinh, Hai-Dang
;
Lee, Ching-Ting
;
Sahoo, Kartika Chandra
Electro-optic characteristics of a fabricated n-In0.4Ga0.6N/p-Si hetero-structure solar cell on Si substrate with Al and ITO (or Ti/Al/Ni/Au) materials for p and n-type contacts were investigated in this letter. The solar cell devices with ITO as n-type contacts were also compared to the solar cell using Ti/Al/Ni/Au as n-type contact in this study. High short-circuit current density observed for solar cell with ITO as n-type contacts due to the increased amount of light reaching the solar cell. The device with ITO contact exhibited an open-circuit voltage (V-oc) of 1.52 V and a short-circuit current density (J(sc)) of 8.68 mA/cm(2) with 54% fill factor. The conversion and external quantum efficiency (EQE) of the solar cell were 7.12 and 20.8%, respectively. Besides, a relationship between V-oc and In content in the InxGa1-xN alloys for this type of solar cell was also derived. (C) 2012 Elsevier B.V. All rights reserved.
Ge epitaxial films on GaAs (100), (110), and (111) substrates for applications of CMOS heterostructural integrations
(2013-03-01)
Tang, Shih-Hsuan
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Kuo, Chien-I
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Trinh, Hai-Dang
;
Chang, Edward Yi
;
Nguyen, Hong-Quan
Epitaxial Ge films were grown on GaAs (100), (110), and (111) substrates by using ultra-high vacuum chemical vapor deposition and studied with various methods. The incubation times and growth rates were quite different for these three GaAs substrates because the surface arsenic coverage on GaAs and hydrogen desorption energy on Ge are different for each orientation. High-resolution x-ray diffraction measurements, direct band-gap emission of photoluminescence measurements, and cross-sectional transmission electron microscopy showed that the Ge films had high crystal quality, low defect density, and sharp Ge/GaAs interfaces. In this study, atomic force microscopy analysis found that the Ge films grow on GaAs (100) and (111) via the Frank van der Merwe mode, while the Ge film grows on GaAs (110) via the Volmer-Weber mode at the initial growth stage, which can be explained by the thermodynamic theory of capillarity. Interestingly, when the thickness of the Ge film on the GaAs (110) substrate increases to similar to 220 nm, the 3D Ge islands merge and form a smooth surface (rms roughness of 0.3 nm), which is useful for devices. The authors also fabricated Ge metal-oxide-semiconductor capacitors (MOSCAPs) on GaAs (100) and (110) substrates. Both Ge/GaAs (100) and Ge/GaAs (110) MOSCAPs exhibit good capacitance-voltage responses with strong inversion behaviors, which means the grown material has reached device quality. The Ge/GaAs (110) structure especially offers optimal integration of Ge pMOSFETs on GaAs substrates because Ge (110) has a high hole mobility compared with Ge (100) and (111). (C) 2013 American Vacuum Society. [http://dx.doi.org/10.1116/1.4789427]
High k/III-V Structures: Interfaces, Oxides Quality and Down Scaling
(2012)
Trinh, Hai-Dang
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Chang, Edward Yi
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材料科學與工程學系
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Department of Materials Science and Engineering
In this paper, we present our studies on high k/InGaAs and high k/InSb structures, focusing on the interfaces, oxides qualities as well as down scaling the gate oxide. We indicate the free movement of Fermi level in both kinds of n- and p-InGaAs MOSCAPs. The effect of gases plasma treatments in the improvement of gate oxides as well as high k/InGaAs interface quality is also discussed. For high k/InSb structure, the effect of post deposition annealing temperatures on electrical properties of this structure is presented. Finally, we present our efforts on down scaling the equivalent oxide thickness of these structures into sub-nm size.
High quality Ge thin film grown by ultrahigh vacuum chemical vapor deposition on GaAs substrate
(2011-04-18)
Tang, Shih-Hsuan
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Chang, Edward Yi
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Hudait, Mantu
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Maa, Jer-Shen
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Liu, Chee-Wee
High-quality epitaxial Ge films were grown on GaAs substrates by ultrahigh vacuum chemical vapor deposition. High crystallinity and smooth surface were observed for these films by x-ray diffraction, transmission electron microscopy, and atomic force microscopy. Direct band gap emission (1550 nm) from this structure was detected by photoluminescence. Valence band offset of 0.16 eV at the Ge/GaAs interface was measured by x-ray photoelectron spectroscopy. N-type arsenic self-doping of 10(18)/cm(-3) in the grown Ge layers was determined using electrochemical capacitance voltage measurement. This structure can be used to fabricate p-channel metal-oxide-semiconductor field-effect transistor for the integration of Ge p-channel device with GaAs n-channel electronic device. (C) 2011 American Institute of Physics. [doi:10.1063/1.3580605]
Impact of Q-Time on the Passivation of Al2O3/p-In0.53Ga0.47As Interfaces Using Various Surface Treatments
(2014)
Luc, Quang-Ho
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Chang, Edward Yi
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Trinh, Hai-Dang
;
Wong, Yuen-Yee
;
Do, Huy-Binh
In this article, we demonstrate the influences of atmosphere exposure duration between extrinsic chemical treatment and ALD chamber loading (Q-time) on the passivation effect of the Al2O3/p-In0.53Ga0.47As interfaces. With the use of various chemical solutions and TMA pretreatment, nice capacitance-voltage (C-V) characteristics of Al2O3/p-In0.53Ga0.47As metal-oxide-semiconductor capacitors (MOSCAPs) were obtained with different Q-times before the ALD-Al2O3 deposition. This confirms that Q-time is not the critical issue determining the Al2O3/In0.53Ga0.47As interface quality. X-ray photoelectron spectroscopy (XPS) analyzes in conjunction with the electrical characterizations have implied that the InGaAs native oxides might not play a major role on the interface trap states formation. (C) 2014 The Electrochemical Society. All rights reserved.
In-x Ga1-x As Materials for Post CMOS Application: Materials and Device Aspects
(2014)
Chang, Edward Yi
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Lin, Yueh-Chin
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Luc, Quang-Ho
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Trinh, Hai-Dang
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Yao, Jing-Neng
High mobility InxGa1-xAs material is one of the most promising candidates as channel material for post CMOS device applications. In this presentation, InxGa1-xAs material based MOS capacitors will be studied for possible applications for future III-V MOSFET, TFET and FINFET devices. To improve the gate leakage of the InxGa1-xAs MOSCAP, the combination of wet chemical treatment and in-situ trimethyl aluminum (TMA) pretreatment was found to be the most effective method for InxGa1-xAs surface cleaning to achieve a fully inverted InxGa1-xAs MOSCAP for post CMOS digital applications. In addition, a high-k composite oxide composed of La2O3 and HfO2 is investigated for InxGa1-xAs metal-oxide-semiconductor (MOS) capacitor application. The composite oxide was formed by depositing five layers of La2O3(0.8 nm)/HfO2(0.8 nm) on InxGa1-xAs with post deposition annealing at 500 degrees C. The MOS capacitors fabricated show good inversion behavior, high capacitance, low leakage current, with excellent interface trap density (D-it) of 7.0 x 10(11) cm(-2)eV(-1), small hysteresis of 200 mV and low capacitance equivalent thickness of 2.2 nm at 1 kHz were also achieved.
InAs-Channel Metal-Oxide-Semiconductor HEMTs with Atomic-Layer-Deposited Al(2)O(3) Gate Dielectric
(2009-01-01)
Chang, Chia-Yuan
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Hsu, Heng-Tung
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Chang, Edward Yi
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Trinh, Hai-Dang
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Miyamoto, Yasuyuki
N-type metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) devices with an InAs-channel using atomiclayer-deposited (ALD) Al(2)O(3) as a gate dielectric have been fabricated and characterized. The device performances of a set of scaled transistors with and without high-k gate dielectric Al(2)O(3) have been compared to determine the optimum device structure for low power and high speed applications. The measurement results revealed that the high performance InAs-channel MOS-HEMTs with the ALD Al(2)O(3) gate dielectric can be achieved if the structure is designed properly. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3241014] All rights reserved.
InAs-Channel Metal-Oxide-Semiconductor HEMTs with Atomic-Layer-Deposited Al2O3 Gate Dielectric
(2009-01-01)
Chang, Chia-Yuan
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Hsu, Heng-Tung
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Chang, Edward Yi
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Trinh, Hai-Dang
;
Miyamoto, Yasuyuki
N-type metal-oxide-semiconductor high electron mobility transistor (MOS-HEMT) devices with an InAs-channel using atomiclayer-deposited (ALD) Al2O3 as a gate dielectric have been fabricated and characterized. The device performances of a set of scaled transistors with and without high-k gate dielectric Al2O3 have been compared to determine the optimum device structure for low power and high speed applications. The measurement results revealed that the high performance InAs-channel MOS-HEMTs with the ALD Al2O3 gate dielectric can be achieved if the structure is designed properly. (C) 2009 The Electrochemical Society. [DOI: 10.1149/1.3241014] All rights reserved.
InAs-Channel Metal-Oxide-Semiconductor HEMTs with Atomic-Layer-Deposited Al2O3 Gate Dielectric
(2009-01-01)
Chang, Chia-Yuan
;
Chang, Edward Yi
;
Huang, Wei-Ching
;
Su, Yung-Hsuan
;
Trinh, Hai-Dang
The performance of n-type metal-oxide-semiconductor HEMTs with an InAs-channel using atomic-layer-deposited Al2O3 as gate dielectric has been fabricated and evaluated. The device performances of a set of scaled transistors with different gate dielectric thicknesses of 3, 5 and 7 nm have been investigated to determine whether the architecture of Al2O3 dielectric on InAs-channel HEMT can demonstrate good properties at low bias conditions for high-speed, high performance CMOS applications. The results indicate that the high-performance InAs-channel MOS-HEMTs with an ALD Al2O3 gate dielectric are promising candidates for advanced post-Si CMOS applications.
Investigation of Characteristics of Al2O3/n-In (x) Ga1-x As (x=0.53, 0.7, and 1) Metal-Oxide-Semiconductor Structures
(2013-08-01)
Trinh, Hai-Dang
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Lin, Yueh-Chin
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Kuo, Chien-I
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Chang, Edward Yi
;
Hong-Quan Nguyen
The electrical properties of Al2O3/n-InGaAs metal-oxide-semiconductor capacitors (MOSCAPs) with In content of 0.53, 0.7, and 1 (InAs) have been investigated. Results show small capacitance-voltage (C-V) frequency dispersion in accumulation (1.70% to 1.85% per decade) for these MOSCAPs, mostly being assigned to border traps in Al2O3. With higher In content, shorter minority-carrier response time and smaller C-V hysteresis are observed. The reduction of C-V hysteresis might be related to the reduction of Ga-bearing oxides in Al2O3/InGaAs interfaces as indicated by x-ray photoelectron spectroscopy.