Browsing by Author "Wu, Chung-Hsi"

Now showing 1 - 4 of 4

A TSV-Based Bio-Signal Package With mu-Probe Array
(2014-02-01)
Chou, Lei-Chun
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Lee, Shih-Wei
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Huang, Po-Tsang
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Chang, Chih-Wei
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Chiang, Cheng-Hao
Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.
A TSV-Based Heterogeneous Integrated Neural-Signal Recording Device with Microprobe Array
(2014-01-01)
Chou, Lei-Chun
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Lee, Shih-Wei
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Cheng, Chuan-An
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Huang, Po-Tsang
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Chang, Chih-Wei
Highly integrated and miniaturized neural sensing microsystems are crucial for brain function investigation and neural prostheses realization. This paper presents a TSV-based heterogeneous integrated neural-signal recording device with microprobe array. By TSV, microprobe array and CMOS circuit make connection on the opposite sides of the chip. By measurement results on electrical characteristics of devices and TSV, this recording device is ready for bio-medical applications.
Integrated Microprobe Array and CMOS MEMS by TSV Technology for Bio- Signal Recording Application
(2014-01-01)
Chou, Lei-Chun
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Lee, Shih-Wei
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Huang, Po-Tsang
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Chang, Chih-Wei
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Wu, Shang-Lin
Bio-signal probes that provide stable observation with high-quality signals are crucial for understanding how the brain works and how the neural signal transmits. Because bio-signals are weak and noisy, the length of the string connecting the sensor and Complementary Metal-Oxide-Semiconductor (CMOS) circuit significantly impacts biosignal quality. The collected weak signals from the sensor must pass through a series of interconnections and interfaces that introduce noise and lead to bulky packaged systems. This work uses through-silicon via (TSV) technology to connect the mu-probe array bio-sensor and CMOS circuit located on opposite sides of a chip for brain neural sensing applications. With the elimination of wire bonding and the reduction of the soldering, bio-signal quality can be significantly improved.
Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
(2013-01-01)
Chang, Chih-Wei
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Huang, Po-Tsang
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Chou, Lei-Chun
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Wu, Shang-Lin
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Lee, Shih-Wei