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學術出版;;Publications
會議論文;;Conferences Paper
Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
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Date
2013-01-01
Authors
Chang, Chih-Wei
Huang, Po-Tsang
Chou, Lei-Chun
Wu, Shang-Lin
Lee, Shih-Wei
Chuang, Ching-Te
Chen, Kuan-Neng
Chiou, Jin-Chern
Hwang, Wei
Lee, Yen-Chi
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https://ir.lib.nycu.edu.tw/handle/11536/129817
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