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Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications

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dc.citation.epageU882en_US
dc.citation.spage102en_US
dc.citation.volume56en_US
dc.citation.woscount1en_US
dc.contributor.authorChang, Chih-Weien_US
dc.contributor.authorHuang, Po-Tsangen_US
dc.contributor.authorChou, Lei-Chunen_US
dc.contributor.authorWu, Shang-Linen_US
dc.contributor.authorLee, Shih-Weien_US
dc.contributor.authorChuang, Ching-Teen_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.contributor.authorChiou, Jin-Chernen_US
dc.contributor.authorHwang, Weien_US
dc.contributor.authorLee, Yen-Chien_US
dc.contributor.authorWu, Chung-Hsien_US
dc.contributor.authorChen, Kuo-Huaen_US
dc.contributor.authorChiu, Chi-Tsungen_US
dc.contributor.authorTong, Ho-Mingen_US
dc.contributor.department交大名義發表zh_TW
dc.contributor.departmentNational Chiao Tung Universityen_US
dc.date.accessioned2016-03-28T00:05:44Z
dc.date.available2016-03-28T00:05:44Z
dc.date.issued2013-01-01en_US
dc.description.abstracten_US
dc.identifier.isbn978-1-4673-4513-2; 978-1-4673-4515-6en_US
dc.identifier.issn0193-6530en_US
dc.identifier.journal2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC)en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/129817
dc.identifier.wosnumberWOS:000366612300037en_US
dc.language.isoen_USen_US
dc.titleThrough-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applicationsen_US
dc.typeProceedings Paperen_US

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