Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications

標題:	Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
作者:	Chang, Chih-Wei Huang, Po-Tsang Chou, Lei-Chun Wu, Shang-Lin Lee, Shih-Wei Chuang, Ching-Te Chen, Kuan-Neng Chiou, Jin-Chern Hwang, Wei Lee, Yen-Chi Wu, Chung-Hsi Chen, Kuo-Hua Chiu, Chi-Tsung Tong, Ho-Ming 交大名義發表 National Chiao Tung University
公開日期:	1-一月-2013
摘要:
URI:	http://hdl.handle.net/11536/129817
ISBN:	978-1-4673-4513-2; 978-1-4673-4515-6
ISSN:	0193-6530
期刊:	2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC)
Volume:	56
起始頁:	102
結束頁:	U882
顯示於類別：	會議論文