Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications

Title:	Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
Authors:	Chang, Chih-Wei Huang, Po-Tsang Chou, Lei-Chun Wu, Shang-Lin Lee, Shih-Wei Chuang, Ching-Te Chen, Kuan-Neng Chiou, Jin-Chern Hwang, Wei Lee, Yen-Chi Wu, Chung-Hsi Chen, Kuo-Hua Chiu, Chi-Tsung Tong, Ho-Ming 交大名義發表 National Chiao Tung University
Issue Date:	1-Jan-2013
Abstract:
URI:	http://hdl.handle.net/11536/129817
ISBN:	978-1-4673-4513-2; 978-1-4673-4515-6
ISSN:	0193-6530
Journal:	2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC)
Volume:	56
Begin Page:	102
End Page:	U882
Appears in Collections:	Conferences Paper