標題: Through-Silicon-Via-Based Double-Side Integrated Microsystem for Neural Sensing Applications
作者: Chang, Chih-Wei
Huang, Po-Tsang
Chou, Lei-Chun
Wu, Shang-Lin
Lee, Shih-Wei
Chuang, Ching-Te
Chen, Kuan-Neng
Chiou, Jin-Chern
Hwang, Wei
Lee, Yen-Chi
Wu, Chung-Hsi
Chen, Kuo-Hua
Chiu, Chi-Tsung
Tong, Ho-Ming
交大名義發表
National Chiao Tung University
公開日期: 1-Jan-2013
摘要: 
URI: http://hdl.handle.net/11536/129817
ISBN: 978-1-4673-4513-2; 978-1-4673-4515-6
ISSN: 0193-6530
期刊: 2013 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE DIGEST OF TECHNICAL PAPERS (ISSCC)
Volume: 56
起始頁: 102
結束頁: U882
Appears in Collections:Conferences Paper