| 標題: | 60GHz傳送接收器之覆晶多晶片模組構裝技術與設備開發計畫(II) |
| 作者: | 成維華 CHIENG WEI-HUA 國立交通大學機械工程學系(所) |
| 公開日期: | 2008 |
| 官方說明文件#: | NSC97-2623-E009-002-IT |
| URI: | http://hdl.handle.net/11536/101869 https://www.grb.gov.tw/search/planDetail?id=1653623&docId=283116 |
| Appears in Collections: | Research Plans |
Files in This Item:
If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.
