標題: High Frequency Flip Chip Package Process of Polymer Substrate and Structure thereof
作者: Chang, Edward-yi
Hsu, Li-Han
Oil, Chee-Way
Wu, Wei-Cheng
Wang, Chin-te
公開日期: 30-Sep-2010
摘要: In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.
官方說明文件#: H01L021/56
URI: http://hdl.handle.net/11536/105379
專利國: USA
專利號碼: 20100248430
Appears in Collections:Patents


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