Title: | Vertical Transmission Structure |
Authors: | Chang, Edward Yi Wu, Wei-Cheng Hwang, Ruey-Bing Hsu, Li-Han |
Issue Date: | 29-Oct-2009 |
Abstract: | A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core. |
Gov't Doc #: | H01L023/498 H01P001/00 |
URI: | http://hdl.handle.net/11536/105471 |
Patent Country: | USA |
Patent Number: | 20090267201 |
Appears in Collections: | Patents |
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