Title: Vertical Transmission Structure
Authors: Chang, Edward Yi
Wu, Wei-Cheng
Hwang, Ruey-Bing
Hsu, Li-Han
Issue Date: 29-Oct-2009
Abstract: A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.
Gov't Doc #: H01L023/498
H01P001/00
URI: http://hdl.handle.net/11536/105471
Patent Country: USA
Patent Number: 20090267201
Appears in Collections:Patents


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