Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kow, Chang | en_US |
dc.contributor.author | Yuan, Chung | en_US |
dc.date.accessioned | 2014-12-16T06:16:19Z | - |
dc.date.available | 2014-12-16T06:16:19Z | - |
dc.date.issued | 2004-04-01 | en_US |
dc.identifier.govdoc | H01L021/44 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/105779 | - |
dc.description.abstract | A method of manufacturing a thin film transistor for solving the drawbacks of the prior art is disclosed. The method includes steps of providing an insulating substrate, sequentially forming a source/drain layer, a primary gate insulating layer, and a first conducting layer on the insulating substrate, etching the first conducting layer to form a primary gate; sequentially forming a secondary gate insulating layer and a second conducting layer on the primary gate; and etching the second conducting layer to form a first secondary gate and a second secondary gate. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | Structure of thin film transistor and manufacturing method thereof | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 20040063311 | zh_TW |
Appears in Collections: | Patents |
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