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dc.contributor.authorShen, Yu-Anen_US
dc.contributor.authorChen, Chihen_US
dc.date.accessioned2017-04-21T06:56:24Z-
dc.date.available2017-04-21T06:56:24Z-
dc.date.issued2017-02en_US
dc.identifier.issn1359-6462en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.scriptamat.2016.09.028en_US
dc.identifier.urihttp://hdl.handle.net/11536/132733-
dc.description.abstractThe effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectGrain orientationen_US
dc.subjectAnisotropic diffusionen_US
dc.subjectIntermetallic compoundsen_US
dc.subjectElectromigrationen_US
dc.titleEffect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigrationen_US
dc.identifier.doi10.1016/j.scriptamat.2016.09.028en_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.citation.volume128en_US
dc.citation.spage6en_US
dc.citation.epage9en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000388783500002en_US
Appears in Collections:Articles


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