標題: Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration
作者: Shen, Yu-An
Chen, Chih
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Grain orientation;Anisotropic diffusion;Intermetallic compounds;Electromigration
公開日期: 二月-2017
摘要: The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.scriptamat.2016.09.028
http://hdl.handle.net/11536/132733
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2016.09.028
期刊: SCRIPTA MATERIALIA
Volume: 128
起始頁: 6
結束頁: 9
顯示於類別:期刊論文