Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration

doi:10.1016/j.scriptamat.2016.09.028

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Shen, Yu-An	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2017-04-21T06:56:24Z	-
dc.date.available	2017-04-21T06:56:24Z	-
dc.date.issued	2017-02	en_US
dc.identifier.issn	1359-6462	en_US
dc.identifier.uri	http://dx.doi.org/10.1016/j.scriptamat.2016.09.028	en_US
dc.identifier.uri	http://hdl.handle.net/11536/132733	-
dc.description.abstract	The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn intermetallic compounds (IMCs) during electromigration were investigated. Significant anisotropic diffusion of Cu in Sn grains was observed. Interfacial Cu-Sn IMCs may grow rapidly, dissolve, or remain intact, depending on the angle of c-axis of Sn grains with the electron flow. In addition, grain boundaries did not play an important role in Cu diffusion because they are mostly cyclic twins. (C) 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.	en_US
dc.language.iso	en_US	en_US
dc.subject	Grain orientation	en_US
dc.subject	Anisotropic diffusion	en_US
dc.subject	Intermetallic compounds	en_US
dc.subject	Electromigration	en_US
dc.title	Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration	en_US
dc.identifier.doi	10.1016/j.scriptamat.2016.09.028	en_US
dc.identifier.journal	SCRIPTA MATERIALIA	en_US
dc.citation.volume	128	en_US
dc.citation.spage	6	en_US
dc.citation.epage	9	en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000388783500002	en_US
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