HIGH-SENSITIVITY CMUT WITH INTERLAYER METAL ARCHITECTURE FOR MEDICAL ULTRASONIC SYSTEMS

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DC Field	Value	Language
dc.contributor.author	Cheng, Teng-Chuan	en_US
dc.contributor.author	Liao, Yu-Te	en_US
dc.contributor.author	Tsai, Tsung-Heng	en_US
dc.date.accessioned	2017-04-21T06:49:30Z	-
dc.date.available	2017-04-21T06:49:30Z	-
dc.date.issued	2015	en_US
dc.identifier.isbn	978-1-4799-8955-3	en_US
dc.identifier.uri	http://hdl.handle.net/11536/135764	-
dc.description.abstract	This paper presents an integration of the capacitive micromachined ultrasonic transducers (CMUTs) and the transimpedance amplifier in medical ultrasound systems. The proposed CMUT and the sensing circuits are both fabricated on the same chip in a 0.18 mu m CMOS MEMS technology. Two interlayer metal structures are proposed to improve the sensitivity. The CMUTs are designed with 2MHz cells for medical diagnosis. The conversion efficiency of the CMUTs is 4 times and 1.8 times higher than that in the published structures.	en_US
dc.language.iso	en_US	en_US
dc.subject	CMUT	en_US
dc.subject	TIA	en_US
dc.subject	ultrasonic sensor	en_US
dc.subject	transducer	en_US
dc.title	HIGH-SENSITIVITY CMUT WITH INTERLAYER METAL ARCHITECTURE FOR MEDICAL ULTRASONIC SYSTEMS	en_US
dc.type	Proceedings Paper	en_US
dc.identifier.journal	2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS)	en_US
dc.citation.spage	1211	en_US
dc.citation.epage	1214	en_US
dc.contributor.department	電機學院	zh_TW
dc.contributor.department	College of Electrical and Computer Engineering	en_US
dc.identifier.wosnumber	WOS:000380461400301	en_US
dc.citation.woscount	1	en_US
Appears in Collections:	Conferences Paper