標題: | Characteristic Improvement of Inkjet Printed Ag Interconnects Using Tape On-Off and Mirror-Reaction Processes |
作者: | Guo, Zi-Li Fu, Yu-Min Cheng, Yu-Ting Shew, Bor-Yuan Wu, Pu-Wei 材料科學與工程學系 電子工程學系及電子研究所 Department of Materials Science and Engineering Department of Electronics Engineering and Institute of Electronics |
公開日期: | 2015 |
摘要: | In the paper, we develop and implement the processes of tape on-off and Ag mirror-reaction to the previously developed size scalable inkjet printing process technique, i.e. CPLoP (Combined Process of Lift-off and Printing) for continuing its future interconnect applications in flexible microelectronics. The newly developed processes not only reduce coffee ring effect but also improve better electrical conductivity of the printed Ag interconnects at low process temperature. A 10 mu m wide Ag interconnect with flat surface morphology and low electrical resistivity, i.e. 7.7 mu Omega center dot cm, has been realized. |
URI: | http://hdl.handle.net/11536/136097 |
ISBN: | 978-1-4799-9928-6 |
ISSN: | 1946-1550 |
期刊: | PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015) |
起始頁: | 41 |
結束頁: | 44 |
顯示於類別: | 會議論文 |