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dc.contributor.authorPerng, Der-Baauen_US
dc.contributor.authorLiu, Hsiao-Weien_US
dc.contributor.authorChang, Ching-Chingen_US
dc.date.accessioned2014-12-08T15:20:32Z-
dc.date.available2014-12-08T15:20:32Z-
dc.date.issued2011-12-01en_US
dc.identifier.issn0268-3768en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s00170-011-3338-yen_US
dc.identifier.urihttp://hdl.handle.net/11536/14625-
dc.description.abstractLight-emitting diodes (LED) are used in many different applications. However, some LED defects are unavoidable in large-volume fabrication and taping processes. These defects may include missing components, incorrect orientations, inverse polarity, mouse bites, missing gold wires, and surface stains. Human visual inspection has traditionally been used in LED-packaging factories. However, it is subjective, time consuming, and lacking consistent inspection results. This paper proposes a machine vision system combining an automatic system-generated inspection regions (IR) method to inspect two types of LED surface-mounted devices (SMDs). Experimentation revealed that the proposed automatic inspection method could successfully detect defects with up to 95% accuracy for both types (Types 1 and 2) of SMD LEDs. The online inspecting speed was on average under 0.3 s per image.en_US
dc.language.isoen_USen_US
dc.subjectLEDen_US
dc.subjectVision inspectionen_US
dc.subjectMachine visionen_US
dc.subjectDefect detectionen_US
dc.titleAutomated SMD LED inspection using machine visionen_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s00170-011-3338-yen_US
dc.identifier.journalINTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGYen_US
dc.citation.volume57en_US
dc.citation.issue9-12en_US
dc.citation.spage1065en_US
dc.citation.epage1077en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000296629100019-
dc.citation.woscount9-
Appears in Collections:Articles


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