標題: | A Multiple Supply Voltage Based Power Reduction Method in 3-D ICs Considering Process Variations and Thermal Effects |
作者: | Yu, Shih-An Huang, Pei-Yu Lee, Yu-Min 電信工程研究所 Institute of Communications Engineering |
公開日期: | 2009 |
摘要: | In this paper, a grid-based multiple supply voltage (MSV) assignment method is presented to statistically minimize the total power consumption of 3-D IC. This method consists of a statistical electro-thermal simulator to get the mean and variance of on-chip, a thermal-aware statistical static timing analysis (SSTA) to take into account the thermal effect on circuit timing, the statistical power-delay-sensitivity-slack product to be the optimization criterion, and an incremental update of statistical timing to save the runtime. The experimental results demonstrate the effectiveness of the developed methodology and indicate that the consideration of the thermal effect in the circuit simulation is imperative. |
URI: | http://hdl.handle.net/11536/17073 |
ISBN: | 978-1-4244-2748-2 |
期刊: | PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009 |
起始頁: | 55 |
結束頁: | 60 |
顯示於類別: | 會議論文 |