Investigation into the Performance of CNT-Interconnects by Spin Coating Technique

Abstract

In this work, we proposed a simple fabrication process, spin coating and dry etching, to construct CNT-interconnects. The CNT-interconnects formed by the slow rate spin coating method have conductivity of more than 10(2) (Stein) and the CNT-interconnects with 10(2) square numbers possess about 30% conductive probability. In addition, we inserted metal bridges into 1000-mu m-long CNT-interconnects to effectively facilitate the performance.