| Title: | The preferential growth of eta-Cu6Sn5 on (111) uni-directional Cu pads |
| Authors: | Lin, Han-wen Lu, Jia-ling Liu, Chen-min Chen, Chih Tu, King-ning Chen, Delphic Kuo, Jui-Chao 材料科學與工程學系 Department of Materials Science and Engineering |
| Issue Date: | 2012 |
| URI: | http://hdl.handle.net/11536/22018 |
| ISBN: | 978-1-4673-1638-5 |
| ISSN: | 2150-5934 |
| Journal: | 2012 7TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) |
| Appears in Collections: | Conferences Paper |
- Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu / Lin, Han-wen;Lu, Chia-ling;Liu, Chien-min;Chen, Chih;Chen, Delphic
- 以控制銅錫介金屬化合物的晶體方向與形貌改善微電子封裝可靠度之研究 / 林漢文;Lin, Han-Wen;陳智;Chen, Chih
- Transition from flip chip solder joint to 3D IC microbump: Its effect on microstructure anisotropy / Tu, K. N.;Hsiao, Hsiang-Yao;Chen, Chih
- Formation of nearly void-free Cu3Sn intermetallic joints using nanotwinned Cu metallization / Chiu, Wei-Lan;Liu, Chien-Min;Haung, Yi-Sa;Chen, Chih
- Low resistance and high reliable Cu-to-Cu joints using highly (111)-oriented nano-twinned copper / Juang, Jing Ye;Shie, Kai Cheng;Li, Yu Jin;Tu, K. N.;Chen, Chih
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