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dc.contributor.authorPan, TMen_US
dc.contributor.authorLei, TFen_US
dc.contributor.authorChao, TSen_US
dc.date.accessioned2014-12-08T15:44:02Z-
dc.date.available2014-12-08T15:44:02Z-
dc.date.issued2001-03-15en_US
dc.identifier.issn0021-8979en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.1347405en_US
dc.identifier.urihttp://hdl.handle.net/11536/29764-
dc.description.abstractHigh-k cobalt-titanium oxide (CoTiO3) and nickel-titanium oxide (NiTiO3) were formed by directly oxidizing sputtered Co/Ti and Ni/Ti film. Al/CoTiO3/Si3N4/Si and Al/NiTiO3/Si3N4/Si capacitor structures were fabricated and measured. The effective dielectric constant (k value congruent to 45) with buffer layer for CoTiO3 is larger than that of NiTiO3. In addition, CoTiO3 depicts excellent electrical properties at the same time. This metal oxide thus appears to be a very promising high-k gate dielectric for future ultralarge scale integrated devices. (C) 2001 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titleComparison of ultrathin CoTiO3 and NiTiO3 high-k gate dielectricsen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.1347405en_US
dc.identifier.journalJOURNAL OF APPLIED PHYSICSen_US
dc.citation.volume89en_US
dc.citation.issue6en_US
dc.citation.spage3447en_US
dc.citation.epage3452en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000167248100059-
dc.citation.woscount17-
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