| 標題: | 實用銅膜之化學氣相沉積技術研究(II) Study and Development of Practical Copper Film Deposition by CVD Method (II) |
| 作者: | 陳茂傑 國立交通大學電子工程學系 |
| 公開日期: | 2003 |
| 官方說明文件#: | NSC92-2215-E009-018 |
| URI: | http://hdl.handle.net/11536/91845 https://www.grb.gov.tw/search/planDetail?id=873424&docId=167322 |
| Appears in Collections: | Research Plans |
- 實用銅膜之化學氣相沉積技術研究(I) / 陳茂傑
- 實用銅膜之化學氣相沈積技術研究 / 陳茂傑
- 銅膜化學氣相沉積之技術開發與銅膜整合參氟二氧化矽在積體電路上的應用 / 林璧君;Pi-Jiun Lin;陳茂傑;Mao-Chieh Chen
- Effects of the underlayer substrates on copper chemical vapor deposition / Lin, CL;Chen, PS;Chen, MC
- Characteristics of copper films deposited on H(2)-plasma-treated TaN substrate by chemical vapor deposition / Lin, CL;Chen, PS;Chang, CL;Chen, MC
- Via-filling capability of copper film by CVD / Lin, CL;Chen, PS;Lin, YC;Tsui, BY;Chen, MC
- 碘乙烷催化劑對銅化學氣相沉積特性之影響 / 王安志;Wang, An-Chih;陳茂傑;Chen, Mao-Chieh
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