銲錫接點熱疲乏斷裂之研究---無鉛焊錫(II)

Date

Authors

Keywords

電子構裝, 可靠度, 焊錫接點, 熱疲乏, 無鉛焊錫, Electronic package, Reliability, Solder joint, Thermal fatigue, Unlead solder

URI

https://www.grb.gov.tw/search/planDetail?id=230177&docId=41820
https://ir.lib.nycu.edu.tw/handle/11536/95644

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研究計畫;;Research Plans