| 標題: | 薄膜構裝導線的電性分析(II) Electrical Analysis of Wirngs in Thin-Film Packaging (II) |
| 作者: | 吳瑞北 WU RUEY-BEEI 國立台灣大學電機工程學系 |
| 公開日期: | 1994 |
| 官方說明文件#: | NSC83-0404-E002-053 |
| URI: | http://hdl.handle.net/11536/97247 https://www.grb.gov.tw/search/planDetail?id=109839&docId=17485 |
| 顯示於類別： | 研究計畫 |
- 超導薄膜物理與應用---子計畫III：脈衝雷射蒸鍍高溫超導、光電、陶瓷薄膜研究(II) / 吳光雄;WU KAUNG-HSIUNG
- Y-Ba-Cu-O高溫超導薄膜材料熱學及電學性質之研究(II) / 曲新生;CHU, HSIN-SEN
- Effect of bottom electrodes on resistance degradation and breakdown of (Ba, Sr)TiO3 thin films / Tsai, MS;Tseng, TY
- Y-Ba-Cu-O高溫超導薄膜材料熱學及電學性質之研究(II) / 曲新生;CHU, HSIN-SEN
- Off-axis unbalanced magnetron sputtering of YBa2Cu3O7 thin films / Tsai, WC;Tseng, TY
- Effect of Au thickness on laser beam penetration in semiconductor laser packages / Cheng, WH;Wang, SC;Yang, YD;Chi, S;Sheen, MT
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