| 標題: | 電流對鉛-錫合金凝固組織影響之研究 The Effect of Direct Current on Solidification Structure of Pb-Sn Alloys |
| 作者: | 朝春光 CHAO CHUEN-GUANG 交通大學材料科學工程研究所 |
| 公開日期: | 1993 |
| 官方說明文件#: | NSC82-0405-E009-109 |
| URI: | http://hdl.handle.net/11536/98033 https://www.grb.gov.tw/search/planDetail?id=46847&docId=6736 |
| 顯示於類別： | 研究計畫 |
- 電流對鉛錫共晶合金凝固組織影響之研究 / 駱學龍;Shyue-Long Louh;朝春光;Chuen-Guang Chao
- 錫鉍共晶奈米線材之製備、生成機制與應用 / 陳士勛;Chen, Shih-Hsun;朝春光;劉增豐;Chao, Chuen-Guang
- Novel morphology and solidification behavior of eutectic bismuth-tin (Bi-Sn) nanowires / Chen, Shih Hsun;Chen, Chien Chon;Chao, Chuen Guang
- Redistribution of Pb-rich phase during electromigration in eutectic SnPb solder stripes / Chou, CK;Chen, CA;Liang, SW;Chen, C
- Kinetic study of the intermetallic compound formation between eutectic Sn-3.5Ag alloys and electroplated Ni metallization in flip-chip solder joints / Chen, Hsiao-Yun;Chen, Chih
- Electromigration-induced Pb and Sn whisker growth in SnPb solder stripes / Wei, C. C.;Liu, P. C.;Chen, Chih;Tu, K. N.
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