【Spotlights】National Yang Ming Chiao Tung University’s Successful Challenge to the Next-Generation Angstrom-Level Integrated Circuit Technology, with Potential to Go “More than Moore”
| dc.citation.issue | 2023-07 | en_US |
| dc.contributor.author | 國際事務處 | zh_TW |
| dc.contributor.author | Office of International Affairs | en_US |
| dc.date.accessioned | 2023-08-08T03:01:33Z | |
| dc.date.available | 2023-08-08T03:01:33Z | |
| dc.date.issued | 2023-08-01 | en_US |
| dc.description.abstract | National Yang Ming Chiao Tung University’s Successful Challenge to the Next-Generation Angstrom-Level Integrated Circuit Technology, with Potential to Go “More than Moore” | en_US |
| dc.identifier.journal | 陽明交大英文電子報 | zh_TW |
| dc.identifier.journal | NYCU E-NEWS | en_US |
| dc.identifier.uri | https://www.nycu.edu.tw/news/4903/ | en_US |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/161149 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | 國立陽明交通大學 | zh_TW |
| dc.publisher | National Yang Ming Chiao Tung University | en_US |
| dc.title | 【Spotlights】National Yang Ming Chiao Tung University’s Successful Challenge to the Next-Generation Angstrom-Level Integrated Circuit Technology, with Potential to Go “More than Moore” | en_US |
| dc.type | Historical News | en_US |