Integrated Circuit Device
| dc.citation.patentcountry | USA | zh_TW |
| dc.citation.patentnumber | 20130169355 | zh_TW |
| dc.contributor.author | Chen Kuan-Neng | en_US |
| dc.contributor.author | Lai Ming-Fang | en_US |
| dc.contributor.author | Chen Hung-Ming | en_US |
| dc.date.accessioned | 2014-12-16T06:14:57Z | |
| dc.date.available | 2014-12-16T06:14:57Z | |
| dc.date.issued | 2013-07-04 | en_US |
| dc.description.abstract | An integrated circuit device includes: a first chip including a first substrate and a main circuit formed on said first chip; a second chip stacked on the first substrate and including a second substrate that is independent from the first substrate, and a protective circuit for protecting the main circuit; and a conductive channel unit extending from the protective circuit and electrically connected to the main circuit. | zh_TW |
| dc.identifier.govdoc | H01L025/00 | zh_TW |
| dc.identifier.uri | https://ir.lib.nycu.edu.tw/handle/11536/105024 | |
| dc.language.iso | zh_TW | en_US |
| dc.title | Integrated Circuit Device | zh_TW |
| dc.type | Patents | en_US |