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深次微米元件內熱載子效應所造成汲極漏電流特性退化之研究

dc.contributor.author汪大暉en_US
dc.contributor.authorWANG TAHUIen_US
dc.contributor.department交通大學電子工程系zh_TW
dc.date.accessioned2014-12-13T10:36:59Z
dc.date.available2014-12-13T10:36:59Z
dc.date.issued1999en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC88-2215-E009-042zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=418062&docId=74158en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/94320
dc.language.isozh_TWen_US
dc.subject深次微米zh_TW
dc.subject熱載子zh_TW
dc.subject洩漏電流zh_TW
dc.subject退化zh_TW
dc.subject汲極zh_TW
dc.subject氧化層zh_TW
dc.subject金氧半場效電晶體zh_TW
dc.subjectDeep submicrometeren_US
dc.subjectHot carrieren_US
dc.subjectLeakage currenten_US
dc.subjectDegradationen_US
dc.subjectDrainen_US
dc.subjectOxided layeren_US
dc.subjectMOSFETen_US
dc.title深次微米元件內熱載子效應所造成汲極漏電流特性退化之研究zh_TW
dc.titleHot Carrier Stress Induced Drain Leakage Current Degradation in Deep Submicron MOSFET'sen_US
dc.typePlanen_US

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