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薄膜型微波通訊被動元件之設計與製作---子計畫II:高介電薄膜型微波通訊被動元件之研製(II)

dc.contributor.author林鵬en_US
dc.contributor.authorLIN PANGen_US
dc.contributor.department交通大學材料科學與工程系zh_TW
dc.date.accessioned2014-12-13T10:35:26Z
dc.date.available2014-12-13T10:35:26Z
dc.date.issued2001en_US
dc.description.sponsorship行政院國家科學委員會zh_TW
dc.identifier.govdocNSC90-2213-E009-039zh_TW
dc.identifier.urihttps://www.grb.gov.tw/search/planDetail?id=663468&docId=125777en_US
dc.identifier.urihttps://ir.lib.nycu.edu.tw/handle/11536/93433
dc.language.isozh_TWen_US
dc.subject薄膜zh_TW
dc.subject微波通信元件zh_TW
dc.subject高介電材料zh_TW
dc.subjectThin filmen_US
dc.subjectMicrowave communication deviceen_US
dc.subjectHigh dielectric materialen_US
dc.title薄膜型微波通訊被動元件之設計與製作---子計畫II:高介電薄膜型微波通訊被動元件之研製(II)zh_TW
dc.titleHigh-Dielectric Thin-Film Microwave Communication Devices(II)en_US
dc.typePlanen_US

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